Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed of a high permittivity layer sandwiched between conductive planes. An organic portion of the substrate includes suitable routing and fan-out of power and signal conductors. The organic portion includes a build-up of multiple layers of organic material overlying the ceramic portion. Also described are an electronic system, a data processing system, and various methods of manufacture.
1. A data processing system comprising:
a bus coupling components in the data processing system;
a display coupled to the bus;
external memory coupled to the bus; and
a processor coupled to the bus and comprising an electronic assembly including:
a die comprising first and second power supply nodes and a first signal node; and
a multilayer substrate comprising:
a ceramic portion comprising a second signal node and at least one embedded capacitor having a first terminal and a second terminal; and
an organic portion comprising a plurality of conductors, including a first conductor coupling the first power supply node to the first terminal, a second conductor coupling the second power supply node to the second terminal, and a third conductor coupling the first signal node to the second signal node.
2. The data processing system recited in claim 1 , wherein the plurality of conductors are fanned out within the organic portion.
3. The data processing system recited in claim 1 , wherein the organic portion comprises a plurality of layers, each comprising a portion of the plurality of conductors.