IP Library Granted Patent US 7,120,056
Granted Patent B2
US 7,120,056 · App. 10/848,694 · Granted Oct 10, 2006

Semiconductor memory device capable of being mounted on a single package regardless of bit organization

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,120,056
App. No.
10/848,694
Granted
Oct 10, 2006
Kind
B2
Abstract

A flash memory device includes a plurality of data pads to receive data from an adjacent plurality of data pins. A signal generation circuit generates a plurality of selection signals responsive to bit organization and package signals. A buffer circuit buffers the data from the plurality of data pads. An input switch receives the data from the buffer circuit and transmits the data to the data lines responsive to the selection signals. And an output switch provides data to the buffer circuit responsive to the selection signals.

Claims (56)

1. A flash memory device comprising:

a plurality of adjacent data pads to receive data from plurality of adjacent data pins;

a signal generation circuit to generate a plurality of bit organization selection signals responsive to bit organization and package signals;

a buffer circuit to buffer the data from the plurality of adjacent data pads;

an input switch to receive the data from the buffer circuit and to transmit the data to the data lines responsive to the selection signals; and

an output switch to provide data to the buffer circuit responsive to the bit organization selection signals.

2. The flash memory device of claim 1 where the buffer circuit includes a plurality of input buffers connected to adjacent data pads.

3. The flash memory device of claim 2

where some input buffers operate regardless of the bit organization signal; and

where other input buffers operate responsive to the bit organization signal.

4. The flash memory device of claim 2 where the signal generation circuit includes:

an option circuit to generate the bit organization signals; and

a decoder to generate the selection signals responsive to the bit organization and package signals.

5. The flash memory device of claim 1 where the signal generation circuit includes one of a bonding circuit and a fuse circuit.

6. The flash memory device of claim 1

where the bit organization signal indicates one of an X 8 and an X 16 bit organization.

7. The flash memory device of claim 1 where the input switch includes:

a plurality of first input switches to receive data from the buffer circuit and to transmit the received data through a first group of data lines; and

a plurality of second input switches to receive data from the buffer circuit and to transmit the received data to a second group of data lines.

8. The flash memory device of claim 7

where each first input switch is a corresponding first input multiplexer; and

where each second input switch is a corresponding second input multiplexer.

9. The flash memory device of claim 1 where the output switch includes:

a plurality of first output switches to provide data to the buffer circuit from a first group of data lines; and

a plurality of second output switches to provide data to the buffer circuit from a second group of data lines.

10. The flash memory device of claim 9

where each first output switch is a corresponding first output multiplexer; and

where each second output switch is a corresponding second output multiplexer.

11. The flash memory device of claim 2 where the buffer circuit includes:

a plurality of input buffers;

a plurality of output buffers; and

a control circuit to enable the plurality of input and output buffers.

12. The flash memory device of claim 11

where some output buffers operate regardless of the bit organization signal; and

where other output buffers operate responsive to the bit organization signal.

13. A NAND-type flash memory device comprising:

a memory cell array to store data;

a plurality of adjacent data pads electrically coupled to adjacent data pins;

a plurality of input buffers electrically coupled to an adjacent plurality of data pads;

a plurality of output buffers electrically coupled to the adjacent plurality of data pads;

a signal generation circuit to generate selection signals according to bit organization and package signals;

an input switch to transmit data from the data pads to a plurality of data lines responsive to the selection signals; and

an output switch to transmit data from the plurality of data lines to the output buffers responsive to the selection signals.

14. The NAND-type flash memory device of claim 13

where some input buffers operate regardless of the bit organization signal; and

where other input buffers operate according to the bit organization signal.

15. The NAND-type flash memory device of claim 13

where some output buffers operate regardless of the bit organization signal; and

where other output buffers operate according to the bit organization signal.

16. The NAND-type flash memory device of claim 13 where the signal generation circuit includes a bonding circuit.

17. The NAND-type flash memory device of claim 13 where the signal generation circuit includes a fuse circuit.

18. The NAND-type flash memory device of claim 13 where the bit organization signal indicates one of an X 8 organization and an X 16 organization.

19. The NAND-type flash memory device of claim 13 where the package signal indicates a minor configuration.

20. The NAND-type flash memory device of claim 13

where the input switch includes a plurality of input multiplexers that operate responsive to the selection signals; and

where the output switch includes a plurality of output multiplexers that operate responsive to the selection signals.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2004
From: KIM, SOON-YOUNG; LEE, JUNE; KWON, OH-SUK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 014932/0231 →
Priority Claims (1)
KR 10-2003-0032347 · May 21, 2003 · national
Continuity (1)
Related Publication 20040233721A1 · Nov 25, 2004