IP Library Granted Patent US 7,125,582
Granted Patent B2
US 7,125,582 · App. 10/631,627 · Granted Oct 24, 2006

Low-temperature silicon nitride deposition

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,125,582
App. No.
10/631,627
Granted
Oct 24, 2006
Kind
B2
Abstract

A method including combining a silicon source precursor and a nitrogen source precursor at a temperature up to 550° C.; and forming a silicon nitride film. A system including a chamber; a silicon precursor source coupled to the chamber; a controller configured to control the introduction into the chamber of a silicon precursor from the silicon precursor source; and a memory coupled to the controller comprising a machine-readable medium having a machine-readable program embodied therein for directing operation of the system, the machine-readable program including instructions for controlling the second precursor source to introduce an effective amount of silicon precursor into the chamber at a temperature up to 550° C.

Claims (40)

1. A method comprising:

combining a specific silicon source precursor and a nitrogen source precursor at a temperature up to 550° C.; and

forming a silicon nitride film, wherein the silicon source precursor has one of the general formula:

where R 1 is a saturated or unsaturated hydrocarbon chain comprising one or more carbon atoms,

where each of R 2 and R 3 is selected from a hydrogen, a halogen, and a saturated or unsaturated hydrocarbon moiety;

where each of R 4 and R 5 is selected from a saturated or unsaturated hydrocarbon; and

the general formula:

Si(NRC x H y NR) a H 4-2n ,

where R is selected from a H and a saturated or unsaturated hydrocarbon moiety,

where x is an integer greater than or equal to one,

where y is an integer greater than or equal to two, and

where a is one or two.

2. The method of claim 1 , wherein the nitrogen source precursor comprises ammonia, a substituted hydrazine, or an unsubstituted hydrazine.

3. A method comprising:

combining a silicon source precursor and a nitrogen source precursor; and

forming a silicon nitride film,

wherein the silicon source precursor is selected from one of the general formula:

where R 1 is a saturated or unsaturated hydrocarbon chain comprising one or more carbon atoms,

where each of R 2 and R 3 is selected from a hydrogen, a halogen, and a saturated or unsaturated hydrocarbon moiety, and

where each of R 4 and R 5 is selected from a saturated or unsaturated hydrocarbon, and

the general formula:

Si(NRC x H y NR) a H 4-2n ,

where R is selected from a H and a saturated or unsaturated hydrocarbon moiety,

where x is an integer greater than one or equal to one,

where y is an integer greater than or equal to two, and

where a is one or two.

4. The method of claim 3 , wherein the nitrogen source precursor comprises ammonia, a substituted hydrazine, or an unsubstituted hydrazine.

5. A method comprising:

combining a aminosilane source precursor and a nitrogen source precursor in a deposition chamber, wherein the aminosilane source precursor comprises a material having a property that will, in combination with the nitrogen source precursor, form a silicon nitride film at a temperature up to 550° C; and

forming a silicon nitride film, wherein the aminosilane is selected from one of the general formula:

where R 1 is a saturated or unsaturated hydrocarbon chain comprising one or more carbon atoms,

where each of R 2 and R 3 is selected from a H, a halogen, and a saturated or unsaturated hydrocarbon moiety, and

where each of R 4 and R 5 is selected from a saturated or unsaturated hydrocarbon, and

the general formula:

Si(NRC x H y NR) a H 4-2a ,

where R is selected from a H and a saturated or unsaturated hydrocarbon moiety,

where x is an integer greater than or equal to one,

where y is an integer greater than or equal to two, and

where a is one or two.

6. The method of claim 5 , wherein the nitrogen source precursor comprises ammonia, a substituted hydrazine, or an unsubstituted hydrazine.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2003
From: MCSWINEY, MICHAEL L.; GOODNER, MICHAEL D.
To: INTEL CORPORATION
Reel/Frame 014358/0777 →
Continuity (1)
Related Publication 20050025885A1 · Feb 3, 2005