Method for forming bump protective collars on a bumped wafer
A method of forming bump protective collars is disclosed. A wafer has an active surface with a plurality of bonding pads and a passivation layer. A plurality of reflowed bumps are formed over the bonding pads. A photoresist is coated on the active surface. Using the reflowed bumps as a photo mask, the photoresist is exposed and developed. After removing the photoresist, a plurality of bump protective collars are formed on the passivation layer and around the reflowed bumps for improving the reliability of the reflowed bumps.
1. A method for forming a plurality of bump protective collars comprising:
providing a wafer having a surface, the wafer having a plurality of bonding pads and a passivation layer on the surface, the passivation layer covering the surface and having a plurality of openings exposing the bonding pads;
forming a plurality of reflowed bumps over the bonding pads of the wafer;
coating a liquid photoresist on the passivation layer; and
patterning the liquid photoresist to form the bump protective collars made of residual of the liquid photoresist, the bump protective collars formed on the passivation layer around the reflowed bumps.
2. The method of claim 1 , wherein the step of patterning the liquid photoresist comprises exposing and developing the liquid photoresist using the reflowed bumps as a photo mask.
3. The method of claim 1 , wherein the photoresist is a positive photoresist.
4. The method of claim 1 , wherein an outer diameter of each bump protective collar is less than the diameter of the corresponding reflowed bump.
5. The method of claim 1 , wherein the reflowed bumps are spherical in shape.
6. The method of claim 1 , wherein the reflowed bumps comprise bonding interfaces on the bonding pads, a diameter of the bonding interfaces being smaller than a diameter of the reflowed bumps.
7. The method of claim 1 , wherein the step of forming the reflowed bumps comprises forming a plurality of solder pastes on the bonding pads of the wafer by plating or printing method and then reflowing the solder pastes to form the reflowed bumps.
8. The method of claim 1 , wherein a material of the bump protective collars is selected from polyimide (PI) or Benezocyclobutene (BCB).