Method for forming a multi-layer low-K dual damascene
View Patent ↗A damascene structure and method for forming the same in a multi-density dielectric insulating layer the method including providing a substrate; forming at least a first layer comprising silicon oxide according to a first process having a first density; forming at least a second layer comprising silicon oxide according to a second process over the first layer having a second density less than the first density; etching a damascene opening through a thickness portion of the at least a first and the at least a second layer; and, filling the damascene opening to form a metal filled damascene.
1. A method for forming a multi-density dielectric insulating layer for forming a metal filled damascene feature therein comprising the steps of:
providing a substrate;
forming at least a first layer comprising silicon oxide according to a first process having a first density;
forming at least a second layer comprising silicon oxide according to a second process over the first layer having a second density less than the first density;
wherein the first layer is formed having a density between about 1.5 and 2.2 gms/cm 2 and the second layer is formed having a density of less than about 2.2 gms/cm 2 ;
etching a damascene opening through a thickness portion of the at least a first and the at least a second layer; and,
filling the damascene opening to form a metal filled damascene.
2. The method of claim 1 , wherein the damascene opening comprises a via portion and an overlying trench line portion.
3. The method of claim 2 , wherein the via portion comprises the at least a first layer and the trench line portion comprises the at least a second layer.
4. The method of claim 1 , wherein the at least a first and the at least a second layer are formed by a process selected from the group consisting of spin-on, CVD, and PECVD.
5. The method of claim 1 , wherein the first and second silicon oxide forming precursors are selected from the group consisting of silsesquioxanes, organo-silanes, and organo-siloxanes.
6. The method of claim 1 , wherein the first and second processes comprise a PECVD process comprising an oxygen containing source gas and a precursor source gas comprising precursors selected from the group consisting of organo-silanes and organo-siloxanes.
7. The method of claim 6 , wherein the oxygen containing source gas is selected from the group consisting of O 2 , O 3 , N 2 O, and NO.
8. The method of claim 6 , wherein the precursor source gas is selected from the group consisting of methylsilanes and methylcyclotetrasiloxanes.
9. The method of claim 6 , wherein the at least a first layer is formed comprising a first relatively lower volumetric gas ratio of precursor source gas to the oxygen containing source gas compared to a respective second volumetric gas ratio for forming the least a second layer.
10. The method of claim 9 , wherein the first relatively lower volumetric gas ratio is lower by about a factor of about ½ to about ¼.
11. The method of claim 1 , wherein a curing process selected from the group consisting of a thermal treatment and a hydrogen containing plasma treatment is carried out following the respective depositions of the at least a first and the at least a second layer.
12. The method of claim 1 , wherein the curing process for the at least a first layer consists essentially of a thermal treatment.
13. The method of claim 1 , wherein the curing process for the at least a second layer consists essentially of a hydrogen containing plasma treatment.
14. A method for forming a metal filled damascene structure within a dual-density dielectric insulating layer comprising the steps of:
providing a semiconductor process wafer comprising a process surface;
forming a first layer comprising silicon oxide over the process surface according to a first process selected from the group consisting of spin-on and CVD;
carrying out a first curing process selected from the group consisting of a thermal treatment and a hydrogen containing plasma treatment to form a first layer having a first density;
forming a second layer over the first layer comprising silicon oxide according to a second process selected from the group consisting of spin-on and CVD;
carrying out a second curing process selected from the group consisting of a thermal treatment and a hydrogen containing plasma treatment to form a second layer having a second density less than the first density wherein the first layer is formed having a density between about 1.5 and 2.2 gms/cm 2 and the second layer is formed having a density of less than about 2.2 gms/cm 2 ; and,
forming a damascene opening extending through a thickness portion of the first and second layers.
15. The method of claim 14 , wherein the spin-on process comprises silicon oxide forming precursors selected from the group consisting of silsesquioxanes, organo-silanes, and organo-siloxanes.
16. The method of claim 14 , wherein the CVD process comprises a PECVD process comprising an oxygen containing source gas and a precursor source gas selected from the group consisting of organo-silanes and organo-siloxanes.
17. The method of claim 16 , wherein the oxygen containing source gas is selected from the group consisting of O 2 , O 3 , N 2 O, and NO.
18. The method of claim 16 , wherein the precursor source gas is selected from the group consisting of methylsilanes and methylcyclotetrasiloxanes.
19. The method of claim 16 , wherein the first layer is formed comprising a first relatively lower volumetric gas ratio of precursor source gas to the oxygen containing source gas compared to a respective second volumetric gas ratio for forming the second layer.
20. The method of claim 19 , wherein the first relatively lower volumetric gas ratio is lower by about a factor of about ½ to about ¼.
21. The method of claim 14 , wherein the first curing process consists essentially of a thermal treatment.
22. The method of claim 14 , wherein the second curing process consists essentially of a hydrogen containing plasma treatment.
23. The method of claim 14 , wherein the damascene opening is a dual damascene opening comprising a via portion formed substantially within the first layer and a trench line portion formed substantially within the second layer.
24. The method of claim 14 , further comprising the steps of:
blanket depositing a barrier layer over the damascene opening; and,
blanket depositing over the barrier layer a metal layer selected from the group consisting of aluminum, tungsten, and copper.
25. The method of claim 24 , wherein the step of blanket depositing comprises a copper electro-chemical deposition process comprising first blanket depositing a continuous copper seed layer.
26. The method of claim 1 , wherein the first and second layers are formed by a respective first and second PECVD process where the first PECVD process comprises a relatively higher proportion of oxygen containing gas relative to a silicon containing precursor gas compared to the second PECVD process.
27. The method of claim 26 , wherein said silicon containing precursor gas is selected from the group consisting of organo-silanes and organo-siloxanes.
28. The method of claim 16 , wherein the first and second layers are formed by a respective first and second PECVD process wherein the first PECVD process comprises a relatively higher proportion of oxygen relative to a precursor gas compared to the second PECVD process.
29. The method of claim 28 , wherein said silicon containing precursor gas is selected from the group consisting of organo-silanes and organo-siloxanes.
30. A method for forming a multi-density dielectric insulating layer for forming a metal filled damascene feature therein comprising the steps of:
providing a substrate;
forming at least a first layer comprising silicon oxide according;
carrying out a first curing process selected from the group consisting of a thermal treatment and a hydrogen containing plasma treatment to form said at least a first layer having a first density;
forming at least a second layer comprising silicon oxide according to a second process over the first layer;
carrying out a second curing process selected from the group consisting of a thermal treatment and a hydrogen containing plasma treatment to form said at least a second layer having a second density less than the first density wherein the first layer is formed having a density between about 1.5 and 2.2 gms/cm 2 and the second layer is formed having a density of less than about 2.2 gms/cm 2 ;
etching a dual damascene opening comprising a via portion and trench line portion through a thickness portion of the at least a first and the at least a second layer wherein the via portion comprises the at least a first layer and the trench line portion comprises the at least a second layer; and,
filling the dual damascene opening with metal to form a metal filled dual damascene.
31. The method of claim 30 , wherein the first and second process are selected from the group consisting of spin-on, CVD, and PECVD.
32. The method of claim 30 , wherein the first and second layers are formed by a respective first and second PECVD process where the first PECVD process comprises a relatively higher proportion of oxygen containing gas relative to a silicon containing precursor gas compared to the second PECVD process.
33. The method of claim 32 , wherein said silicon containing precursor gas is selected from the group consisting of organo-silanes and organo-siloxanes.
34. The method of claim 32 , wherein the silicon containing precursor gas is selected from the group consisting of methylsilanes and methylcyclotetrasiloxanes.
35. The method of claim 30 , wherein the first curing process consists essentially of a thermal process and the second curing process consists essentially of a hydrogen containing plasma treatment.