IP Library Granted Patent US 7,130,498
Granted Patent B2
US 7,130,498 · App. 10/687,442 · Granted Oct 31, 2006

Multi-layer optical circuit and method for making

Assignee: 3M Innovative Properties Company
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Quick Facts
Patent No.
US 7,130,498
App. No.
10/687,442
Granted
Oct 31, 2006
Kind
B2
Abstract

A multi-layer optical circuit has a plurality of optical circuit layers. Each optical circuit layer is positioned on a corresponding one of a plurality of substrates. An optical fiber extends between at least two of the optical circuit layers and forms a portion of the at least two of the plurality of optical circuit layers.

Claims (38)

1. An optical circuit comprising:

a first optical circuit layer disposed on a first substrate portion;

a second optical circuit layer disposed on a second substrate portion;

wherein the first and second substrate portions are physically separate from each other

an optical fiber of the first and second optical circuit layers extending continuously between the first and second optical circuit layers; and

a third optical circuit disposed on a third substrate portion, wherein an optical fiber of the third optical circuit layer extends continuously between the third optical circuit layer and at least one of the first and second optical circuit layers.

2. The optical circuit of claim 1 , wherein the first and second substrate portions are disposed in a stacked orientation.

3. The optical circuit of claim 1 , wherein the first and second substrate portions are connected to each other by a substrate connection portion extending between the first and second substrate portions.

4. The optical circuit of claim 1 , wherein the first and second substrate portions are separated from each other by an open window portion, and wherein the optical fiber extends over the window portion.

5. A method of forming a multi-layer optical circuit comprising:

patterning optical fibers to create a first layer of the optical circuit on a first substrate;

patterning optical fibers to create a second layer of the optical circuit on a second substrate, wherein the first and second substrates are separated from each other, and wherein at least one optical fiber is integral with and extends between the first layer and the second layer;

patterning optical fibers to create a third layer of the optical circuit on a third substrate, and wherein at least one optical fiber extends from at least one of the first layer of the optical circuit on the first substrate and the second layer of the optical circuit on the second substrate; and

positioning the first, second and third substrates in a layered arrangement.

6. The method of claim 5 , wherein positioning the first, second and third substrates in a layered manner comprises laying the second substrate on the first substrate.

7. The method of claim 5 , wherein positioning the first, second and third substrates in a layered manner comprises rotating the second substrate relative to the first substrate.

8. The method of claim 5 , wherein positioning the first, second and third substrates in a layered manner comprises twisting the second substrate relative to the first substrate.

9. The method of claim 5 , wherein positioning the first and second substrates in a layered arrangement occurs subsequent to patterning optical fibers to create a first layer of the optical circuit on a first substrate and patterning optical fibers to create a second layer of the optical circuit on a second substrate.

10. The method of claim 5 , wherein the patterning further comprises securing the optical fibers to the first and second substrates adjacent ends of the optical fibers.

11. The method of claim 5 , wherein the first substrate and the second substrate are connected to each other.

12. The method of claim 11 , wherein the first and second substrates are connected to each other by a substrate strip extending between the first and second substrates.

13. A method of forming a multi-layer optical circuit comprising:

patterning optical fibers to create a first layer of the optical circuit on a first substrate;

patterning optical fibers to create a second layer of the optical circuit on a second substrate, wherein the first and second substrates are separated from each other, and wherein at least one optical fiber is integral with and extends between the first layer and the second layer;

positioning the first and second substrates in a coplanar orientation prior to patterning optical fibers to create a first layer of the optical circuit on the first substrate and patterning optical fibers to create a second layer of the optical circuit on the second substrate, wherein positioning the first and second substrates in a layered arrangement comprises positioning the first and second substrates in a bi-planar orientation subsequent to patterning optical fibers to create a first layer of the optical circuit on the first substrate and patterning optical fibers to create a second layer of the optical circuit on the second substrate.

14. A method of forming a multi-layer optical circuit comprising:

patterning first and second optical circuits on first and second substrates, wherein said first and second circuits include a common optical fiber;

positioning said first and second substrates in a stacked arrangement, wherein said positioning comprises a substrate manipulation selected from the group consisting of bending, folding, twisting and rotating at least one of the first and second substrates relative to the other; and

patterning a third optical circuit on a third substrate, wherein said third circuit includes a common optical fiber with one of said first and second optical circuits.

15. The method of claim 14 , wherein the patterning further comprises patterning said first and second optical circuits in a common plane.

16. The method of claim 14 , wherein the positioning further comprises a substrate manipulation selected from the group consisting of bending, folding, twisting and rotating the third substrate relative to at least one of the first and second substrates.

17. The method of claim 14 , further comprising embedding at least one of said first and second circuits onto its respective substrate.

18. The method of claim 14 , wherein said first and second circuits include a plurality of common optical fibers, and further comprising orienting the common optical fibers in a plane parallel to at least one of the substrates.

19. The method of claim 14 , wherein said first and second circuits include a plurality of common optical fibers, and further comprising orienting the common optical fibers in a plane perpendicular to at least one of the substrates.

20. The method of claim 14 , further comprising providing a crease region between the substrates.

21. The method of claim 20 , further comprising orienting the common optical fiber in said crease region.

22. The method of claim 14 , further comprising providing a window region between the substrates.

23. The method of claim 22 , further comprising orienting the common optical fiber in said window region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2003
From: MEIS, MICHAEL A.; LEE, NICHOLAS A.; HENSON, GORDON D.; CARLSON, LUKE
To: 3M INNOVATIVE PROPERTIES COMPANY
Reel/Frame 014618/0748 →
Continuity (1)
Related Publication 20050084200A1 · Apr 21, 2005