Conductive polishing article for electrochemical mechanical polishing
An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
1. An article of manufacture for polishing a substrate, comprising:
a conductive material layer; and
a polishing material disposed on the conductive material layer, wherein the polishing material comprises a body having at least a partially conductive surface adapted to polish the substrate.
2. The article of claim 1 , wherein the conductive material layer is coupled to a power source.
3. The article of claim 1 , wherein the conductive material layer comprises a metal film.
4. The article of claim 3 , wherein the metal film comprises a noble metal film.
5. The article of claim 2 , wherein the conductive material layer further comprises one or more conductive contacts for coupling to a power source.
6. The article of claim 1 , wherein the polishing material comprises a conductive material disposed in a polymer binder.
7. The article of claim 6 , wherein the conductive material comprises a conductive filler selected from the group of carbon powder, carbon fibers, carbon nanotubes, carbon nanofoam, carbon aerogels, and combinations thereof, and the polymer binder comprises a dielectric material selected from the group of polyurethane, polycarbonate, polyphenylene sulfide, filled polymers, foamed polymers, and combinations thereof.
8. The article of claim 1 , wherein the polishing article and the conductive material layer each further comprise a plurality of perforations formed therein, a plurality of grooves disposed in the polishing surface, or both.
9. The article of claim 8 , wherein at least a portion of the plurality of grooves intersect with at least a portion of a plurality of perforations disposed in the polishing surface of the polishing article.
10. The article of claim 1 , wherein the article of manufacture is disposed on a polishing article support comprising a plurality of perforations disposed therein for flow of material therethrough.
11. The article of claim 10 , wherein a plurality of perforations in the polishing article and conductive material layer are aligned with the plurality of perforations of the polishing article support.
12. The article of claim 1 , wherein the conductive surface has a resistivity of about 10 Ω-cm or less.
13. An article of manufacture for polishing a substrate, comprising:
a perforated dielectric support layer;
a perforated conductive material layer disposed on the perforated dielectric support layer; and
a polishing material disposed on the conductive material layer, the polishing material having a pluralit of perforations and a plurality of grooves formed therein, wherein the polishing material comprises a partially conductive surface adapted to polish the substrate.
14. The article of claim 13 , wherein the article of manufacture is disposed on a polishing article support comprising a plurality of perforations disposed therein for flow of material therethrough.
15. The article of claim 14 , wherein the perforations in the polishing material, the conductive material layer, and the dielectric support layer are aligned with the plurality of perforations of the polishing article support.
16. The article of claim 13 , wherein the conductive material layer is coupled to a power source by one or more conductive contacts.
17. The article of claim 13 , wherein the conductive material layer comprises a metal film and the polishing material comprises a conductive material disposed in a polymer binder.
18. The article of claim 17 , wherein the conductive material layer comprises a noble metal, the conductive material comprises a conductive filler selected from the group of carbon powder, carbon fibers, carbon nanotubes, carbon nanofoam, carbon aerogels, and combinations thereof, and the polymer binder comprises a dielectric material selected from the group of polyurethane, polycarbonate, polyphenylene sulfide, filled polymers, foamed polymers, and combinations thereof.
19. The article of claim 13 , wherein the conductive surface has a resistivity of about 10 Ω-cm or less.
20. The article of claim 13 , wherein at least a portion of the plurality of grooves of the polishing material intersect with at least a portion of a plurality of perforations disposed in the polishing material, the conductive material layer, and the dielectric support layer.