Flash preventing substrate and method for fabricating the same
View Patent ↗A flash preventing substrate and a method for fabricating the same are proposed. A core defined with a plurality of substrate units is prepared. A circuit patterning process is performed to form circuit structures on the core corresponding to the substrate units, plating buses between the adjacent substrate units and electrically connected to the circuit structures, and a molding ring surrounding all the substrate units. The molding ring is located at a position predetermined for contacting the substrate with a mold. A solder mask layer covers the circuit structures, the plating buses and the molding ring, and is formed with a plurality of openings therein, such that predetermined portions of the circuit structures are exposed via the openings and serve as electrical input/output connections. During a molding process, the mold can tightly abut against the solder mask layer covering the molding ring to prevent outward flashes of an encapsulating material.
1. A flash preventing substrate, comprising:
a plurality of substrate units formed with circuit structures;
plating buses provided between the adjacent substrate units, wherein the plating buses are extended and electrically connected to the circuit structures of the substrate units;
a molding ring surrounding all the substrate units and located at a position predetermined for contacting the substrate with a mold; and
a solder mask layer for covering the circuit structures, the plating buses and the molding ring, wherein a plurality of openings are formed in the solder mask layer, such that predetermined portions of the circuit structures are exposed via the openings and serve as electrical input/output connections.
2. The flash preventing substrate of claim 1 , wherein the substrate unit is a ball grid array (BGA) substrate unit.
3. The flash preventing substrate of claim 1 , wherein the substrate unit is a thin and fine pitch ball grid array (TFBGA) substrate unit.
4. The flash preventing substrate of claim 1 , wherein the circuit structures comprise bond pads, conductive vias, conductive circuits and ball pads.
5. The flash preventing substrate of claim 4 , wherein a metallic layer is electroplated respectively on the bond pads and the ball pads via the plating buses.
6. The flash preventing substrate of claim 1 , wherein the molding ring is formed on the substrate simultaneously in a circuit patterning process for fabrication of the circuit structures of the substrate units and the plating buses.
7. The flash preventing substrate of claim 1 , wherein the molding ring is made of a metallic copper material.
8. The flash preventing substrate of claim 1 , wherein the molding ring is formed as a continuous linear shape or a continuous flexural shape, or comprises discontinuous segments spaced from each other.
9. A method for fabricating a flash preventing substrate, comprising the steps of:
preparing a core defined with a plurality of substrate units;
performing a circuit patterning process to form circuit structures on a surface of the core corresponding to the substrate units, plating buses between the adjacent substrate units, and a molding ring surrounding all the substrate units, wherein the plating buses are extended and electrically connected to the circuit structures of the substrate units, and the molding ring is located at a position predetermined for contacting the substrate with a mold; and
forming a solder mask layer for covering the circuit structures, the plating buses and the molding ring, wherein the solder mask layer is formed with a plurality of openings therein, such that predetermined portions of the circuit structures are exposed via the openings and serve as electrical input/output connections.
10. The method of claim 9 , wherein the substrate unit is a ball grid array (BGA) substrate unit.
11. The method of claim 9 , wherein the substrate unit is a thin and fine pitch ball grid array (TFBGA) substrate unit.
12. The method of claim 9 , wherein the circuit structures comprise bond pads, conductive vias, conductive circuits and ball pads.
13. The method of claim 12 , wherein a metallic layer is formed respectively on the bond pads and the ball pads via the plating buses by an electroplating process.
14. The method of claim 9 , wherein the molding ring is made of a metallic copper material.
15. The method of claim 9 , wherein the molding ring is formed as a continuous linear shape or a continuous flexural shape, or comprises discontinuous segments spaced from each other.