Pluggable electronic module
A pluggable electronic module is provided that has an electronic component and a module body enclosing the electronic component. The module body has a first surface and a second surface. The first surface has a first area substantially parallel to the second surface and a second area that defines a non-zero angle with respect to the first area. The second area contacts a thermal sink to dissipate heat generated by the electronic component. The pluggable electronic module has a reduced insertion force in comparison with conventional pluggable electronic modules.
1. An electronic system comprising:
an enclosure comprising a heat sink and an opening;
an electronic module inserted into the opening of the enclosure, the electronic module comprising an electronic component and a module body enclosing the electronic component, the module body having a first surface and a second surface, the first surface having a first area approximately parallel to the second surface and having a second area defining a non-zero angle with respect to the first area, wherein a gap exists between the second area and the heat sink; and
a thermal path between the second area and the heat sink.
2. The module of claim 1 wherein the first surface comprises at least one heat transfer fin extending substantially perpendicular therefrom.
3. The module of claim 1 wherein the module body comprises a thermally conductive material.
4. The module of claim 3 wherein the thermally conductive material comprises aluminum.
5. The module of claim 1 further comprising a thermally conductive pad disposed between the first surface and the thermal sink.
6. The apparatus of claim 5 wherein the thermally conductive pad comprises a silicone elastomer.
7. The apparatus of claim 5 wherein the thermally conductive pad comprises a thermally conductive foam.
8. An electronic system according to claim 1 , wherein the thermal path comprises a thermal spacer and a thermal pad, the thermal pad in contact with a portion of the second area.
9. An electronic system according to claim 8 , wherein the thermal pad comprises a silicone elastomer or a thermally conductive foam.
10. A method of cooling an electronic module comprising:
receiving the electronic module in an opening of a thermal sink, the electronic module having a module body enclosing an electronic component, the module body having a first surface and a second surface, the first surface having a first area approximately parallel to the second surface and having a second area defining a non-zero angle with respect to the first area with a gap existing between the second area and the thermal sink;
providing a thermal path between the second area and the thermal sink; and
dissipating heat generated by the electronic component through the thermal path.
11. The method of claim 10 wherein the providing comprises applying a thermal pad between the second area and the thermal sink.