IP Library Granted Patent US 7,177,154
Granted Patent B2
US 7,177,154 · App. 10/844,717 · Granted Feb 13, 2007

Computer

Assignee: Zalman Tech Co. Ltd.
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Quick Facts
Patent No.
US 7,177,154
App. No.
10/844,717
Granted
Feb 13, 2007
Kind
B2
Abstract

Provided is a computer with a case and a plurality of parts, including heat generating components that generate heat when operated, installed in the case, wherein the case includes a plurality of plates, and heat generated by at least one of the heat generating components when operated is transmitted to at least one of the plates via a heat conduction unit, which connects the at least one of the heat generating parts and the plate, and externally dissipated from the case. The heat generating components mounted in the case can be noiselessly and efficiently cooled without a noise-generating cooling fan.

Claims (26)

1. A computer comprising:

a case formed with a plurality of plates, at least one of the plates including a plurality of heat dissipating fins on an external surface of the plate;

heat generating components received in the case, the heat generating components including a power supply;

at least one heat conduction unit, the at least one heat conduction unit connecting at least one of the heat generating components with at least one of the plates such that heat generated by operation of the heat generating components is transmitted to the at least one of the plates via the at least one heat conduction unit; and

the power supply having a heat conducting member, a surface of the heat conducting member contacting to an internal surface of at least one of the plates such that heat generated by operation of the power supply is transmitted to the at least one of the plates through the heat conducting member and externally dissipated from the case.

2. The computer of claim 1 , wherein a heat pipe is installed between the heat dissipating fins.

3. The computer of claim 1 , wherein the heat generating components include a central processing unit, and the at least one heat conduction unit comprises a heat pipe having an end thermally connected to the central processing unit and the other end thermally connected to the at least one of the plates for transmitting heat there-through.

4. The computer of claim 3 , wherein the heat pipe of the at least one conduction unit has a diameter of 8 mm or less.

5. The computer of claim 1 , wherein the heat generating components include a graphics card, and the at least one heat conduction unit comprises a heat pipe having an end thermally connected to the graphics card and the other end thermally connected to the at least one of the plates for transmitting heat there-through.

6. The computer of claim 3 or 5 , wherein the at least one heat conduction unit each comprises:

a first heat conducting block and a second conducting block connected with the corresponding heat pipe.

7. The computer of claim 1 , wherein the heat conducting member is an aluminum circuit board having a surface contacting the internal surface of the at least one of the plates and the other surface for mounting the heat generating electric components.

8. The computer of claim 1 , wherein at least one of the plates are hinged to one another such that the plates open or close the case.

9. The computer of claim 1 , wherein at least one of the plates comprises an electromagnetic wave interception block preventing electromagnetic waves generated by the parts from exiting the case.

10. The computer of claim 1 , wherein at least one of the plates is made of aluminum.

11. The computer of claim 1 , wherein at least one of the plates comprises:

a guide rail fixed to an internal surface of the corresponding plate; and

a guide member slidably coupled to the guide rail along the length of the guide rail for fixing at least one of the heat generating components.

12. The computer of claim 1 , further comprising at least one leg member on a bottom of the case to space the bottom of the case from the floor.

13. A computer comprising:

a case formed with a plurality of plates, at least one of the plates respectively including a main body portion and a heat dissipating plate portion, the main body portion and the heat dissipating plate portion disposed adjacent to each other and connected to each other via a thermal conductive member disposed between each other such that heat in the case is externally dissipated from the main body portion and the heat dissipating portion;

heat generating components received in the case; and

at least one heat conduction unit, the at least one heat conduction unit connecting at least one of the heat generating components with at least one of the plates such that heat generated by operation of the heat generating components is transmitted to the at least one of the plates via the at least one heat conduction unit and externally dissipated from the case.

14. The computer of claim 13 , wherein the at least one heat conduction unit comprises a heat pipe having an end thermally connected to one of the heat generating components and the other end thermally connected to the heat dissipating plate portion.

15. The computer of claim 13 , wherein the thermal conductive member disposed between the heat dissipating plate portion and the main body portion is a heat pipe.

16. The computer of claim 13 , wherein the heat dissipating plate portion has a plurality of heat dissipating fins protruding from a surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2004
From: LEE, SANG CHEOL
To: ZALMAN TECH CO., LTD.
Reel/Frame 015335/0302 →
Priority Claims (2)
KR 10-2003-0030358 · May 13, 2003 · national
KR 10-2004-0027563 · Apr 21, 2004 · national
Continuity (1)
Related Publication 20040228093A1 · Nov 18, 2004