Laser diode device with an APC inside the cap
A laser diode device of package not greater than 5.6 mm, having an automatic power control circuit directly mounted in a heat sink (or a submount) inside the metal cap thereof to substitute for an external circuit board for driving by voltage instead of current.
1. A laser LED device comprising:
a heat sink, said heat sink having a front side, a back side, and a
plurality of pins respectively extended from said back side for bonding;
a mount provided at the front side of said heat sink;
a submount disposed at said mount;
a laser diode chip and a photo diode chip provided at the front side said heat sink; and
a metal cap bonded to the front side of said heat sink;
wherein an automatic power control circuit is encapsulated in said metal cap and uses said laser diode chip to detect a beam being emitted from a rear end of said laser diode chip and is electrically connected to bonding pins of said heat sink, said laser diode chip, and said photo diode chip by wires,
said automatic power circuit is further connected to a first pin and a second pin that are electrically connected to a power+, power− and a third pin for being connected to an external variable resistor; and
said laser diode chip is mounted to said submount and said photo diode chip and said automatic power control circuit are mounted in a recessed hole in a front side of said heat sink.
2. The laser diode device as claimed in claim 1 , wherein said APC circuit is made in the form of an Integrated circuit (IC).
3. The laser diode device as claimed in claim 1 , wherein said laser diode chip is mounted in said submount, said photo diode chip and said automatic power control circuit are bonded together and mounted in a recessed hole in the front side of said heat sink.