Method and apparatus for low temperature copper to copper bonding
A method comprising: coating a conductive bump on a first substrate with a conductive material to form a coated conductive bump; coating a conductive bump on a second substrate with a conductive material to form a coated conductive bump; and bonding the coated conductive bump on the first substrate to the coated conductive bump on the second substrate to electrically connect the first substrate to the second substrate.
1. A device comprising:
two stacked substrates; and
a plurality of copper bumps provided on each substrate, wherein each of the plurality of copper bumps is coated with a conductive material and opposing coated copper bumps are bonded to one another to electrically connect the two stacked substrates.
2. The device of claim 1 , wherein the conductive material comprises a noble metal.
3. The device of claim 2 , wherein the noble metal comprises silver.
4. The device of claim 3 , wherein the two stacked substrates comprise a semiconductor die substrate and a package substrate.
5. The device of claim 3 , wherein the two stacked substrates comprise semiconductor substrates.