IP Library › Granted Patent US 7,185,823
Granted Patent B2
US 7,185,823 · App. 11/003,439 · Granted Mar 6, 2007

Paper tag identified by using radiofrequency and method of manufacturing the same

Assignee: Hitachi, Ltd.
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Quick Facts
Patent No.
US 7,185,823
App. No.
11/003,439
Granted
Mar 6, 2007
Kind
B2
Abstract

A paper-like RFID tag is fabricated by bonding bumps of an RFID chip to an antenna to connect the chip to the antenna, the antenna being formed by a metal foil bonded onto a base film or a base tape, providing a protecting material around the RFID chip so that an upper surface becomes higher than that of the RFID chip, to constitute an RFID thread, and inlaying the RFID thread in between first and second paper layers to afford a paper-like structure. The thickness of the paper-like RFID tag fabricated as above is 0.1 mm or less. Further, the paper-like RFID tag is of high quality and has a surface smoothness almost equal to that of the ordinary type of paper, permitting a long-distance communication.

Claims (40)

1. A method of manufacturing a paper-like RFID tap, comprising:

an RFID thread assembly process of forming an RFID thread, said RFID thread assembly process includes:

a metal foil laminated film fabricating process of bonding a metal foil to one surface of a base member to form a metal foil laminated film;

an antenna pattern forming process of patterning said metal foil in said metal foil laminated film fabricated in said metal foil laminated film fabricating process to form an antenna;

a protecting material bonding process of bonding a protecting material around an RFID chip on said antenna, said protecting material having a thickness such that a height of an upper surface thereof becomes larger than that of said RFID chip when the RFID chip is bonded by bonding pumps to said antenna; and

an RFID chip bonding process of bonding the bumps of said RFID chip to said antenna; and

a paper making process of inlaying said RFID thread formed in said RFID thread assembly process in between a first paper layer and a second paper layer and conducting heating, pressurizing and dewatering with use of rolls and drying;

wherein said protecting material has a C-shaped or doughnut-shaped surface.

2. The method of manufacturing a paper-like RFID tag according to claim 1 , wherein said antenna pattern forming process includes a resin layer forming process of forming on said metal foil a resin layer for patterning said metal foil to form said antenna.

3. The method of manufacturing a paper-like RFID tag according to claim 1 , wherein said RFID thread is fed continuously and is inlaid between said first and second paper layers, in said paper making process.

4. The method of manufacturing a paper-like RFID tag according to claim 1 , wherein said RFID thread is constituted by said antenna and said base member each having a width of 3 mm or less.

5. The method of manufacturing a paper-like RFID tag according to claim 1 , wherein said protecting material used in said protecting material bonding process Is a protecting tape formed with a window far receiving said RFID chip therein and higher in rigidity than said first and second paper layers.

6. The method of manufacturing a paper-like RFID tag according to claim 1 , wherein said protecting material is a plastic or metallic material.

7. A method of manufacturing a paper-like RFID tag, comprising:

an RFID thread assembly process of forming an RFID thread, said RFID thread assembly process includes:

a metal foil laminated film fabricating process of bonding a metal foil to one surface of a base member to form a metal foil laminated film;

an antenna pattern forming process of patterning said metal foil in said metal foil laminated film fabricated in said metal foil laminated film fabricating process to farm an antenna;

a protecting material bonding process of bonding a protecting material around an RFID chip on said antenna, said protecting material having a thickness such that a height of an upper surface thereof becomes larger than that of said RFID chip when the RFID chip is bonded by bonding pumps to said antenna; and

an RFID chip bonding process of bonding the bumps of said RFID chip to said antenna; and

a paper making process of inlaying said RFID thread formed in said RFID thread assembly process in between a first paper layer and a second paper layer and conducting heating, pressurizing and dewatering with use of rolls and drying;

wherein said paper making process is carried out using a multi-cylinder paper machine.

8. The method of manufacturing a paper-like RFID tag according to claim 7 , wherein said antenna pattern forming process includes a resin layer forming process of forming on said metal foil a resin layer for patterning said metal foil to form said antenna.

9. The method of manufacturing a paper-like RFID tag according to claim 7 , wherein said RFID thread is fed continuously and is inlaid between said first and second paper layers, in said paper making process.

10. The method of manufacturing a paper-like RFID tag according to claim 7 , wherein said RFID thread is constituted by said antenna and said base member each having a width of 3 mm or less.

11. The method of manufacturing a paper-like RFID tag according to claim 7 , wherein said protecting material used in said protecting material bonding process is a protecting tape formed with a window for receiving said RFID chip therein and higher in rigidity than said first and second paper layers.

12. The method of manufacturing a paper-like RFID tag according to claim 7 , wherein said protecting material is a plastic or metallic material.

13. A method of manufacturing a paper-like RFID tag, comprising:

an RFID thread assembly process of forming an RFID thread, said RFID thread assembly process includes:

a metal foil laminated film fabricating process of bonding a metal toil to one surface of a base member to form a metal foil laminated film;

an antenna pattern forming process of patterning said metal foil in said metal foil laminated film fabricated in said metal foil laminated film fabricating process to form an antenna;

a protecting tape bonding process of bonding a protecting tape around an RFID chip on said antenna, said protecting tape having a thickness such that the height of an upper surface thereof becomes larger than that of said RFID chip when the RFID chip is bonded by bonding bumps to said antenna; and

an RFID chip bonding process of bonding the bumps of said RFID chip to said antenna; and

a paper making process of inlaying said RFID thread formed in said RFID thread assembly process in between a first paper layer and a second paper layer and conducting heating, pressurizing and dewatering with use of rolls and drying;

wherein said protecting tape has a C-shaped or doughnut-shaped surface.

14. The method of manufacturing a paper-like RFID tag according to claim 13 , wherein said antenna pattern forming process includes a resin layer forming process of forming a resin layer on said metal foil for patterning the metal foil to form said antenna.

15. The method of manufacturing a paper-like RFID tag according to claim 13 , wherein said protecting tape used in said protecting tape bonding process is higher in rigidity than said first and second paper layers.

16. The method of manufacturing a paper-like RFID tag according to claim 13 , wherein said RFID thread is fed continuously and is inlaid between said first and second paper layers, in said paper making process.

17. The method of manufacturing a paper-like RFID tag according to claim 13 , wherein said RFID thread as constituted by said antenna and said base member each having a width of 3 mm or less.

18. The method of manufacturing a paper-like RFID tag according to claim 13 , wherein said protecting material used in said protecting material bonding process is a protecting tape formed with a window for receiving said RFID chip therein and higher in rigidity than said first and second paper layers.

19. The method of manufacturing a paper-like RFID tag according to claim 13 , wherein said protecting material is a plastic or metallic material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2005
From: INOUE, KOSUKE; KANDA, NAOYA; HONMA, HIROSHI
To: HITACHI, LTD.
Reel/Frame 016352/0463 →
Priority Claims (1)
JP 2004-029377 · Feb 5, 2004 · national
Continuity (1)
Related Publication 20050173541A1 · Aug 11, 2005