Semiconductor device and method of manufacturing the same
A semiconductor device including a semiconductor substrate, a capacitor formed above the semiconductor substrate, a first interlayer insulating film formed above the capacitor and having a trench, a wiring formed above the capacitor and formed in the trench, the wiring have a top surface flush with a top surface of the first interlayer insulating film, a first hydrogen barrier film formed in contact with the top surface of the wiring and the top surface of the first interlayer insulating film and preventing hydrogen from diffusing into the capacitor and a second interlayer insulating film formed on the first hydrogen barrier film.
1. A semiconductor device comprising:
a semiconductor substrate;
a capacitor formed above the semiconductor substrate;
a first interlayer insulating film formed above the capacitor and having a trench;
a wiring formed above the capacitor and formed in the trench, the wiring have a top surface flush with a top surface of the first interlayer insulating film;
a first hydrogen barrier film formed in contact with the top surface of the wiring and the top surface of the first interlayer insulating film and preventing hydrogen from diffusing into the capacitor; and
a second interlayer insulating film formed on the first hydrogen barrier film.
2. The semiconductor device according to claim 1 , further comprising:
a plug connected to the wiring through the second interlayer insulating film; and
a second hydrogen barrier film formed between the second interlayer insulating film and the plug and preventing hydrogen from diffusing into the capacitor.
3. The semiconductor device according to claim 2 , wherein the second hydrogen barrier film is selected from an aluminum oxide film, a silicon nitride film and a silicon oxynitride film.
4. The semiconductor device according to claim 1 , wherein the wiring is electrically connected to the capacitor.
5. The semiconductor device according to claim 1 , further comprising a transistor formed on the semiconductor substrate and electrically connected to the capacitor.
6. The semiconductor device according to claim 1 , wherein the first hydrogen barrier film is selected from an aluminum oxide film, a silicon nitride film and a silicon oxynitride film.
7. The semiconductor device according to claim 1 , wherein a dielectric film of the capacitor includes a ferroelectric film.
8. A semiconductor device comprising:
a semiconductor substrate;
a capacitor formed above the semiconductor substrate;
a wiring formed above the capacitor;
a first hydrogen barrier film formed in contact with a top surface of the wiring and preventing hydrogen from diffusing into the capacitor; and
an interlayer insulating film formed on the first hydrogen barrier film;
a plug connected to the wiring through the interlayer insulating film, the plug being in contact with the wiring; and
a second hydrogen barrier film formed between the interlayer insulating film and the plug and preventing hydrogen from diffusing into the capacitor.
9. The semiconductor device according to claim 8 , wherein the wiring is electrically connected to the capacitor.
10. The semiconductor device according to claim 9 , wherein the second hydrogen barrier film is selected from an aluminum oxide film, a silicon nitride film and a silicon oxynitride film.
11. The semiconductor device according to claim 8 , further comprising a transistor formed on the semiconductor substrate and electrically connected to the capacitor.
12. The semiconductor device according to claim 8 , wherein the first hydrogen barrier film is selected from an aluminum oxide film, a silicon nitride film and a silicon oxynitride film.
13. The semiconductor device according to claim 8 , wherein a dielectric film of the capacitor includes a ferroelectric film.
14. The semiconductor device according to claim 8 , wherein the second hydrogen barrier film is formed of an insulating film.