Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance

1. An apparatus, comprising:

a heat spreader comprising heat conductive material and a contiguous wall structure extending from a surface of the heat spreader;

a package substrate;

a flexible material in contact with the surface of the heat spreader and the package substrate, the flexible material defining a perimeter of a cavity;

a circuit substrate disposed within the cavity; and

at least two stand-offs interdisposed between the surface of the heat spreader and the circuit substrate.

2. The apparatus of claim 1 , wherein the flexible material comprises polymeric sealant material.

3. The apparatus of claim 1 , wherein the heat spreader is plated with nickel.

4. The apparatus of claim 1 , wherein the heat spreader is coated with a heat-conductive organic material.

5. The apparatus of claim 1 further comprising:

a thermal interface material comprising metal particles disposed between a surface of the circuit substrate and the surface of the heat spreader.

6. A semiconductor package, comprising:

a substrate having a surface;

at least one semiconductor device coupled to the surface of the substrate;

a cover coupled to the surface of the substrate through a flexible sealant material, the flexible material contacting a surface of the cover and the surface of the substrate and creating a space between the substrate and the cover, the semiconductor device residing within the space, and the cover comprised of a heat-conductive;

at least two stand-offs interdisposed between the surface of the cover and the semiconductor device; and

a thermal interface material comprising metal particles disposed between a surface of the semiconductor device and the surface of the cover,

wherein the cover comprises a contiguous attachment structure extending from the surface into the flexible material.

7. The semiconductor package of claim 6 , wherein the cover is a heat spreader.