Semiconductor substrate
A semiconductor substrate is partitioned along scribing lines so as to form a plurality of IC regions encompassed by seal rings, wherein a passivation opening is formed in the scribing line in which a monitoring element is formed within a monitoring element region, which is encompassed by secondary seal rings, which are constituted by metal layers, oxidation layers and via holes. The secondary seal rings are formed to encompass the periphery of the monitoring element, which can thus precisely monitor characteristics of integrated circuits because it is possible to prevent water and impurities from infiltrating into the monitoring element region which is thus stabilized in characteristics.
1. A semiconductor substrate that is partitioned along scribing lines so as to form a plurality of IC regions encompassed by seal rings, wherein a passivation opening is formed in the scribing line in which a monitoring element is formed within a monitoring element region, which is encompassed by secondary seal rings.
2. A semiconductor substrate according to claim 1 , wherein the secondary seal rings are each connected with a silicon substrate.
3. A semiconductor substrate according to claim 1 , wherein a part of the secondary seal rings share the same functions of the seal rings used for formation of the IC regions.
4. A semiconductor substrate according to claim 1 , wherein a part of the secondary seal ring, which lies between the monitoring element region and the passivation opening in the scribing line, is removed.
5. A semiconductor substrate according to claim 1 , wherein a width of the seal ring is greater than a width of the secondary seal ring.
6. A semiconductor substrate according to claim 1 , wherein the seal ring has a laminated structure having a plurality of metal layers, which are laminated together via an insulating layer and are mutually connected together via a contact hole.
7. A semiconductor substrate according to claim 1 , wherein the secondary seal ring has a laminated structure having a plurality of metal layers, which are laminated together via an insulating layer and are mutually insulated from each other by way of a via hole.
8. A semiconductor substrate comprising:
scribing lines that partition the semiconductor substrate to form a plurality of IC regions;
first seal rings that encompass each of the IC regions:
at least one passivation opening in the scribing line;
a monitoring element formed within a monitoring element region of the passivation opening; and
secondary seal rings, which encompass the monitoring element.