Manufacturing apparatus
View Patent ↗The purpose of the invention is increasing the efficiency of utilizing an EL material and providing a deposition method and a vapor deposition apparatus which is one of the film formation systems which are excellent in throughput and uniformity in film thickness in forming an EL layer. According to the invention, evaporation is performed by moving or reciprocating an evaporation source holder in which a plurality of containers (crucible) each encapsulating an evaporation material are set only in an X direction while moving a substrate at regular intervals. Further, in the plurality of evaporation source holders, film thickness meters of adjacent evaporation sources are disposed alternately so as to sandwich the movement pathway of the substrate.
1. A method for manufacturing a semiconductor device comprising:
depositing a film over a substrate by repeatedly moving a first evaporation source and a second evaporation source in an X direction while moving the substrate in a Y direction at regular intervals,
wherein the first evaporation source and the second evaporation source are provided in a same chamber in which the film is deposited.
2. The method according to claim 1 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine, a mobile computer, a cellular phone, a portable game machine, an electronic book, and an image reproducing apparatus.
3. The method according to claim 1 , wherein at least one of the first evaporation source and the second evaporation source includes at least two crucibles arranged in the X direction.
4. A method for manufacturing a semiconductor device comprising;
depositing a film over a substrate by repeatedly moving the substrate in a Y direction at regular intervals while making a movement speed of a first evaporation source in an X direction and a movement speed of a second evaporation source in the X direction different,
wherein the first evaporation source and the second evaporation source are provided in a same chamber in which the film is deposited.
5. The method according to claim 4 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine, a mobile computer, a cellular phone, a portable game machine, an electronic book, and an image reproducing apparatus.
6. The method according to claim 4 , wherein at least one of the first evaporation source and the second evaporation source includes at least two crucibles arranged in the X direction.
7. A method for manufacturing a semiconductor device comprising:
depositing a film over a substrate by moving an evaporation source including first and second crucibles in the X direction while moving the substrate in the Y direction,
wherein each of the first and second crucibles includes shutter.
8. The method according to claim 7 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine, a mobile computer, a cellular phone, a portable game machine, an electronic book, and an image reproducing apparatus.
9. The method according to claim 7 , wherein the evaporation source includes the first and second crucibles arranged in the X direction.
10. A method for manufacturing a semiconductor device comprising:
depositing an EL material over a substrate by repeatedly moving a first evaporation source and a second evaporation source in an X direction while moving the substrate in a direction at regular intervals,
wherein the first evaporation source and the second evaporation source are provided in a same chamber in which the EL material is deposited.
11. The method according to claim 10 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine, a mobile computer, a cellular phone, a portable game machine, an electronic book, ad an image reproducing apparatus.
12. The method according to claim 10 , wherein at least one of the first evaporation source and the second evaporation source includes at least two crucibles arranged in the X direction.
13. A method for manufacturing a semiconductor device comprising:
depositing an EL material over a substrate by repeatedly moving the substrate in a Y direction at regular intervals while making a movement speed of a first evaporation source in an X direction and a movement speed of a second evaporation source in the X direction different,
wherein the first evaporation source and the second evaporation source are provided in a same chamber in which the EL material is deposited.
14. The method according to claim 13 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine, a mobile computer, a cellular phone, a portable game machine, an electronic book, and a image reproducing apparatus.
15. The method according to claim 13 , wherein at least one of the first evaporation source and the second evaporation source includes at least two crucibles arranged in the X direction.
16. A method for manufacturing a semiconductor device comprising:
depositing an EL material over a substrate by moving an evaporation source including first and second crucibles in the X direction while moving the substrate in the Y direction,
wherein each of the first and second crucibles includes a shutter.
17. The method according to claim 16 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine, a mobile computer, a cellular phone, a portable game machine, an electronic book, and an image reproducing apparatus.
18. The method according to claim 16 , wherein the evaporation source includes the first and second crucibles arranged in the X direction.
19. A method for manufacturing a semiconductor device comprising:
depositing a film over a substrate by moving a first evaporation source and a second evaporation source in the X direction while moving the substrate in the Y direction at a constant speed,
wherein at least one of the first evaporation source and the second evaporation source includes first and second crucibles, and
wherein each of the first and second crucibles includes a shutter.
20. The method according to claim 19 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine, a mobile computer, a cellular phone, a portable game machine, an electronic book, and an image reproducing apparatus.
21. The method according to claim 19 , wherein the first and second crucibles are arranged in the X direction.
22. The method according to claim 19 , wherein the first evaporation source and the second evaporation source are provided in a same chamber in which the film is deposited.
23. A method for manufacturing a semiconductor device comprising:
depositing a film over a substrate by moving a first evaporation source and a second evaporation source in the X direction while moving the substrate in the Y direction at a constant speed,
wherein at least one of the first evaporation source and the second evaporation source includes first and second crucibles, and
wherein each of the first and second crucibles includes a shutter.
24. The method according to claim 23 , wherein the semiconductor device is incorporated into an electronic apparatus selected from the group consisting of a video camera, a digital camera, a goggle display, a navigation system, an audio reproducing apparatus, a laptop computer, a game machine; a mobile computer, a cellular phone, a portable game machine, an electronic book, and an image reproducing apparatus.
25. The method according to claim 23 , wherein the first and second crucibles are arranged in the X direction.
26. The method according to claim 23 , wherein the first evaporation source and the second evaporation source are provided in a same chamber in which the EL material is deposited.