Condenser microphone assembly
A microphone assembly comprising a housing, the housing including an upper lip, a silicon backplate having a top portion, a bottom portion, an annular side portion, a silicon spacer integrally formed with the backplate and comprising at least one protrusion extending from and integral to the top portion of the silicon backplate, the spacer further comprising an insulating layer, such as silicon dioxide or a fluoropolymer. A plurality of openings extend from the top portion of the backplate to the bottom portion of the backplate. A single diaphragm, comprised of metallized polymer film, acts as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer. A metal ring is positioned against the upper lip of the metal housing. The diaphragm is adhesively affixed to the ring, and the ring, in cooperation with the upper lip and a spring, secure the diaphragm against the insulating layer of the spacer.
1. A microphone assembly comprising:
a housing;
a semiconductor backplate mounted in the housing;
a flexible diaphragm located above the backplate, the flexible diaphragm acting as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer;
a semiconductor spacer integral to the backplate and intermediate the backplate and the diaphragm; and
a diaphragm frame, the diaphragm stretched over and adhesively affixed to the diaphragm frame, the diaphragm frame maintaining tension in the diaphragm, the diaphragm frame being independent from the semiconductor backplate and the semiconductor spacer.
2. A microphone assembly as in claim 1 wherein the diaphragm is comprised of a material consisting of the group metal film or metallized polymer.
3. A microphone assembly as in claim 2 wherein the housing is metal.
4. A microphone assembly as in claim 3 wherein the backplate is silicon.
5. A microphone assembly as in claim 4 wherein the spacer further comprises an insulating layer from the group consisting of silicon dioxide or a fluoropolymer.
6. A microphone assembly as in claim 5 wherein the backplate includes a top portion, a bottom portion, and a side portion and a plurality of openings extending from the top portion of the backplate to the bottom portion of the backplate.
7. A microphone assembly as in claim 1 further comprising an integrated circuit coupled to the backplate, the integrated circuit having a transistor.
8. A microphone assembly as in claim 1 further comprising an integrated circuit coupled to the backplate, the integrated circuit having a voltage step up circuit.
9. A microphone assembly as in claim 1 further comprising an integrated circuit coupled to the backplate, the integrated circuit having an RF biasing circuit.
10. A microphone assembly as in claim 9 wherein the RF biasing circuit generates an RF modulated output and the RF modulated output is used for RF wireless transmission.
11. A microphone assembly as in claim 1 further comprising an integrated circuit coupled to the backplate, the integrated circuit having a digital signal processor.
12. A microphone assembly as in claim 1 further comprising an integrated circuit coupled to the backplate, the integrated circuit having an analog to digital converter.
13. A microphone assembly as in claim 1 wherein the housing includes an upper edge and the upper edge presses the diaphragm frame and the diaphragm into the spacer.
14. A microphone assembly comprising:
a housing;
a semiconductor backplate mounted in the housing;
a semiconductor spacer comprising a protrusion extending from and integral to the backplate;
a single diaphragm comprised of the group consisting of a metal film or a metallized polymer film, the single diaphragm acting as both a protective environmental barrier and a sensing electrode of a capacitate electroacoustic sensing transducer; and
a diaphragm frame, the diaphragm stretched over and adhered to the frame, the diaphragm frame being independent from the semiconductor backplate and the semiconductor spacer.