Anisotropically conductive adhesive comprising crushable microcapsules adhered to a surface of conductive particles
This invention provides a mounting method for reliably connecting mounting components electrically. Specifically, an anisotropically conductive adhesive can be composed of crushable microcapsules and a second liquid in which the microcapsules are dispersed. Each microcapsule encloses a first liquid and a conductive particle. The first liquid can react with the second liquid at normal temperatures to cure the second liquid. This anisotropically conductive adhesive can be applied on a flexible printed circuit (FPC). Then, a drive IC is mounted and pressed on the FPC to crush the microcapsules between electrode pads provided on the drive IC and electrode pads provided on the FPC, thereby bonding the electrode pads. Subsequently, the anisotropically conductive adhesive is heated to plasticize a capsule wall of each microcapsule, thereby bonding the drive IC and the FPC.
1. An anisotropically conductive adhesive comprising:
conductive particles each having a plurality of crushable microcapsules that adhere to a surface of the conductive particles, wherein each microcapsule encloses a first substance; and
a second substance that is curable by a reaction with the first substance, the conductive particles are dispersed in the second substance;
wherein the first substance is selected from the group consisting of amines, imidazoles, acid anhydrides, phenols and mixtures thereof; and
the second substance is an uncured epoxy resin.
2. The anisotropically conductive adhesive according to claim 1 wherein the walls of the crushable microcapsules comprises a thermoplastic resin.
3. The anisotropically conductive adhesive according to claim 1 , wherein the second substance contains a third substance that is curable by a reaction with the second substance, the reaction occurring by heating
the third substance is selected from the group consisting of imidazoles, acid anhydrides, phenols and mixtures thereof.
4. An anisotropically conductive adhesive comprising:
conductive particles each having a plurality of crushable microcapsules that adhere to a surface of the conductive particles, wherein each microcapsule encloses a first substance; and
a second substance that is curable by a reaction with the first substance, the conductive particles are dispersed in the second substance;
wherein the first substance is an uncured epoxy resin; and
the second substance is selected from the group consisting of amines, imidazoles, acid anhydrides, phenols and mixtures thereof.
5. The anisotropically conductive adhesive according to claim 4 , wherein the second substance contains a third substance that is curable by a reaction with the second substance, the reaction occurring by heating, the third substance is selected from the group consisting of amines, imidazoles, acid anhydrides, phenols and mixtures thereof.