Vision system
A vision system and method for calibrating motion of a robot disposed in a processing system is provided. In one embodiment, a vision system for a processing system includes a camera and a calibration wafer that are positioned in a processing system. The camera is positioned on the robot and is adapted to obtain image data of the calibration wafer disposed in a predefined location within the processing system. The image data is utilized to calibrate the robots motion.
1. A method for calibrating motion of a robot disposed in a semiconductor processing system, the method comprising:
moving a calibration wafer supported by a robot to a reference position within the semiconductor processing system;
viewing the calibration wafer to obtain wafer position data; and
utilizing the wafer position data to correct the reference position.
2. The method of claim 1 , wherein the step of utilizing the wafer position data further comprises:
displaying an image of the calibration wafer on a monitor;
comparing the image of the calibration wafer to a reference image displayed on the monitor; and
determining a correction distance.
3. The method of claim 1 , wherein the step of utilizing the wafer position data further comprises:
comparing image data of the calibration wafer to reference data; and
determining a correction distance.
4. The method of claim 1 , wherein the step of viewing the calibration wafer further comprises:
passing a camera into the semiconductor processing system.
5. The method of claim 4 , wherein the step of viewing the calibration wafer to obtain wafer position data further comprises:
viewing a surface supporting the calibration wafer through the calibration wafer.
6. The method of claim 4 , wherein the step of viewing the calibration wafer to obtain wafer position data further comprises:
viewing an indicator of position of the calibration wafer.
7. The method of claim 6 , wherein the step of viewing the indicator of position of the calibration wafer further comprises:
identifying at least one of a geometric or visual feature of the calibration wafer.
8. The method of claim 1 , wherein the step of viewing the calibration wafer further comprises:
moving a camera mounted on a plate supported on an end effector of a robot through the semiconductor processing system.
9. The method of claim 1 , wherein the step of moving further comprising:
positioning the calibration wafer in the semiconductor processing system utilizing a stored robotic motion routine; wherein the viewing step further comprises:
viewing the calibration wafer with a camera; and wherein the step of utilizing the wafer position data to correct the reference position further comprises:
updating the stored robotic motion routine utilizing image data of the wafer.
10. The method of claim 9 further comprising:
moving the camera within a vacuum environment of the semiconductor processing system.
11. The method of claim 10 , wherein the step of moving the camera further comprises:
supporting the camera on an end effector of a robot.
12. The method of claim 9 further comprising:
transmitting images captured by the camera; and
remotely receiving the captured images.
13. The method of claim 9 , wherein the step of viewing the calibration wafer with the camera further comprises:
capturing one or more viewed images.
14. The method of claim 9 , wherein the step of viewing the calibration wafer with the camera further comprises:
capturing one or more images of an indicator of calibration wafer position.
15. The method of claim 14 , wherein the step of capturing one or more images of the indicator of calibration wafer position further comprises:
identifying at least one of a geometric or visual feature of the calibration wafer.