Method for manufacturing medical device having embedded traces and formed electrodes
View Patent ↗Disclosed is a method of manufacturing a catheter or lead having electrically conductive traces and external electrical contacts. Each trace may be in electrical connection with one or more external electrical contacts. More specifically, each trace is typically electrically connected to a single contact. The traces and contacts may assist in diagnosis and/or detection of bio-electric signals emitted by organs, and may transmit such signals to a connector or diagnostic device affixed to the catheter. The external contacts may detect bioelectric energy or may deliver electrical energy to a target site.
1. A method of manufacturing a medical device comprising:
forming a device body by extruding a first cylindrical body layer;
extruding a second cylindrical body layer;
placing the second body layer within the first body layer; and
bonding the second body layer to the first body layer;
forming a first electrically conductive element on the device body;
forming a first electrode on the device body; and
operably connecting the first electrode and the first electrically conductive element.
2. The method of claim 1 , wherein the step of forming a first electrically conductive element on the device body comprises co-extruding a first electrically conductive element within the device body.
3. The method of claim 1 , wherein the step of forming a first electrically conductive element on the device body comprises electro-depositing a conductive material on a nonconductive portion of the device body.
4. The method of claim 1 , wherein the step of extruding the second cylindrical body layer comprises extruding the second cylindrical body layer over the first cylindrical body layer.
5. The method of claim 1 , wherein the step of forming a first electrode on the device body comprises the steps of:
forming a groove on at least a portion of the device body;
depositing conductive material within the groove in a shape of the first electrode; and
in the event that a portion of the conductive material extends beyond an upper surface of the groove, removing the portion of conductive material.
6. The method of claim 5 , wherein the step of forming a groove on at least a portion of the device body is performed simultaneously with the step of forming the device body.
7. The method of claim 1 , wherein the step of forming a first electrically conductive element on the device body comprises the steps of:
co-extruding electrically conductive material with the first cylindrical body layer; and
removing a portion of the first cylindrical body layer to expose at least a portion of the electrically conductive material.
8. The method of claim 1 , wherein the step of forming a first electrically conductive element on the device body comprises:
coating a surface of the device body with an electrically conductive material; and
selectively removing at least a portion of the electrically conductive material from the device body.
9. The method of claim 8 , wherein the step of selectively removing at least a portion of the electrically conductive material from the device body comprises exposing at least a portion of the electrically conductive material to a chemical solvent.
10. The method of claim 8 , wherein the step of selectively removing at least a portion of the electrically conductive material from the device body comprises vaporizing at least a portion of the electrically conductive material with a laser.
11. The method of claim 1 , wherein the step of forming a first electrically conductive element on the device body comprises extruding a conductive layer across at least a portion of the device body.
12. The method claim 11 , further comprising:
extruding a second device body longitudinally encasing the device body and extruded conductive layer; and
extruding a second conductive layer across at least a portion of the second device body.
13. The method of claim 12 , further comprising the steps of:
forming a tip structure; and
affixing the tip structure to the device body.
14. The method of claim 13 , wherein the step of forming a tip structure comprises:
plating a metal electrode over a molded non-conductive tip shape;
forming a via in the tip shape; and
electrically connecting a trace to the metal electrode through the via.
15. The method of claim 1 , wherein the step of forming a first electrically conductive element on the device body comprises:
feeding wire from a spool to a mandrel under tension;
positioning the wire with respect to an ultimate location along the device body means of the mandrel; and
co-extruding the wire with the device body.
16. The method of claim 1 , wherein the step of forming a first electrically conductive element on the device body comprises:
forming a groove on an exterior surface of the device body; and
placing a wire within the groove.
17. The method of claim 1 , further comprising the step of affixing an adaptor to a distal end of the device body.
18. The method of claim 17 , wherein the step of affixing an adapter to a distal end of the device body comprises:
aligning an adapter trace with the first electrically conductive element with an adapter trace; and
inserting a portion of the adapter into the distal end of the device body such that the adapter trace and electrically conductive element are operably connected.