IP Library › Granted Patent US 7,245,494
Granted Patent B2
US 7,245,494 · App. 11/285,028 · Granted Jul 17, 2007

Thermal structure for electric devices

Assignee: CPUMate Inc.
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Quick Facts
Patent No.
US 7,245,494
App. No.
11/285,028
Granted
Jul 17, 2007
Kind
B2
Abstract

A thermal module includes a thermal body, at least one thermal tube, and a holding part. The thermal tube includes a heat receiving portion and condenser terminals connecting with the thermal body, wherein the heat receiving portion has a plane. The holding part includes a plate body with trenches therein, wherein the trenches has through holes and a connecting part formed between the through holes. The through holes are used for receiving and holding the heat receiving portion of the thermal tube. The connecting part are connected with a top surface of the heat receiving portion. Thus, thermal transfer is speed up, and the thermal module is assembled without a thermal treatment which causing a copper reduction reaction, resulting in improvement of thermal conduction, reduction of cost, and manufacturing time saving.

Claims (11)

1. A thermal module, comprising:

a thermal body;

at least one U-shaped thermal tube, comprising a heat receiving portion located at a bottom of the thermal tube and two condenser terminals located at two arms of the thermal tube, wherein the condenser terminals connect with the thermal body, wherein the heat receiving portion comprises a plane; and

a holding part, comprising a plate body with at least one trench therein, wherein the trench comprises two periphery-closed through holes and a connecting part formed between the through holes, the heat receiving portion of the thermal tube is embedded in the trench and passes through the through holes, and the connecting part is leaned against a top surface of the heat receiving portion.

2. The thermal module as claimed in claim 1 , wherein the thermal body is composed of a plurality of fins stacked together.

3. The thermal module as claimed in claim 2 , wherein the fins are made of aluminum, copper, or the combination thereof.

4. The thermal module as claimed in claim 1 , wherein the holding part is made of plastics.

5. The thermal module as claimed in claim 1 , wherein the holding part is made of aluminum.

6. The thermal module as claimed in claim 5 , further comprising a plurality of fins extending from the plate body of the holding part.

7. The thermal module as claimed in claim 1 , wherein the thermal tube is compactly received and held by the trenches of the holding part.

8. The thermal module as claimed in claim 1 , further comprising a fan cover covered on the both sides of the thermal body and fixed on the holding part.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017267 FRAME 0736. ASSIGNOR(S) HEREBY CONFIRMS THE CPUMATE INC. & GOLDEN SUN NEWS TECHNIQUES CO., LTD.. Recorded Oct 19, 2007
From: CHENG, CHIH-HUNG
To: CPUMATE INC.; GOLDEN SUN NEWS TECHNIQUES CO., LTD.
Reel/Frame 019990/0093 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 23, 2005
From: CHENG, CHIH-HUNG
To: CPUMATE INC.
Reel/Frame 017267/0736 →
Priority Claims (1)
TW 94210692 U · Jun 24, 2005 · national
Continuity (1)
Related Publication 20060291166A1 · Dec 28, 2006