IP Library › Granted Patent US 7,245,643
Granted Patent B2
US 7,245,643 · App. 10/747,398 · Granted Jul 17, 2007

Semiconductor laser module and method of manufacturing the same

Assignee: The Furukawa Electric Co., Ltd.
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Quick Facts
Patent No.
US 7,245,643
App. No.
10/747,398
Granted
Jul 17, 2007
Kind
B2
Abstract

A semiconductor laser module according to the present invention includes a polarization-synthesizing module having a polarization-synthesizing means configured to polarization synthesize two laser beams and a holder member for holding the polarization-synthesizing means with an approximately cylindrical circumferential surface, and a supporting member for supporting the holder member at least to rotate about an central axis and fixing the holder member at a predetermined position.

Claims (41)

1. A semiconductor laser module comprising:

a first stripe and a second stripe formed on a semiconductor substrate, said first stripe and said second stripe configured to emit respectively a first laser beam and a second laser beam;

at least one first lens positioned so that the first laser beam and the second laser beam are incident thereon;

a substrate having a mounting surface on which the semiconductor substrate is mounted;

an optical synthesizing module including

an optical synthesizing element having a first input part on which the first laser beam is incident, a second input part on which the second laser beam is incident, and an output part from which the first laser beam emerging from the first input part and the second laser beam emerging from the second input part are emitted, and

a holder member configured to hold the optical synthesizing element and having at least partially substantially columnar peripheral outer surface around a center axis thereof;

a supporting member configured to support said optical synthesizing module at the columnar peripheral surface of the holder member, said supporting member including a bottom plate joined to said substrate and two mutually parallel upright walls provided perpendicularly on both lateral ends of the bottom plate, the two upright walls being parallel to the center axis of the optical synthesizing module; and

an optical fiber configured to receive a laser beam emerging from the output part of the optical synthesizing element,

wherein said optical synthesizing module is fixed to said supporting member in a state that the columnar peripheral surface of the holder member is placed between the two upright walls of said supporting member, and such that the first laser beam emerging from the first input part and the second laser beam emerging from the second input part are combined and emitted as a combined laser beam from the output part generally along the center axis of the holder member.

2. A semiconductor laser module comprising:

a first stripe and a second stripe formed on a semiconductor substrate, said first stripe and said second stripe configured to emit respectively a first laser beam and a second laser beam;

at least one first lens positioned so that the first laser beam and the second laser beam are incident thereon;

a substrate having a mounting surface on which the semiconductor substrate is mounted;

an optical synthesizing module including

an optical synthesizing element having a first input part on which the first laser beam is incident, a second input part on which the second laser beam is incident, and an output part from which the first laser beam emerging from the first input part and the second laser beam emerging from the second input part are emitted, and

a holder member configured to hold the optical synthesizing element and having at least partially substantially columnar peripheral surface around a center axis thereof;

a supporting member configured to support said optical synthesizing module at the columnar peripheral surface of the holder member, said supporting member including two upright walls provided on said substrate, the two upright walls being perpendicular to said substrate and parallel to the center axis of the optical synthesizing module, and

wherein said optical synthesizing module is fixed to said supporting member in a state that the columnar peripheral surface of the holder member is placed between the two upright walls of said supporting member, and such that the first laser beam emerging from the first input part and the second laser beam emerging from the second input part are combined and emitted as a combined laser beam from the output part generally along the center axis of the holder member.

3. The semiconductor laser module according to claim 1 , wherein the holder member further comprises two flat upright inner surfaces on both sides of the center axis, the two flat surfaces being parallel to each other and to the center axis.

4. The semiconductor laser module according to claim 1 , wherein the optical synthesizing element is a polarization synthesizing element.

5. The semiconductor laser module according to claim 4 , wherein the optical synthesizing module further includes a polarization rotating element configured to rotate a polarization direction of at least one of the first laser beam and the second laser beam emerging from said at least one first lens, the polarization rotating element being held by the hold member.

6. The semiconductor laser module according to claim 1 , wherein said first stripe and said second stripe are arrayed on a single semiconductor substrate with a spacing interposed therebetween to form a single semiconductor laser device.

7. The semiconductor laser module according to claim 6 , wherein said at least one first lens consists of a single lens positioned so that the first laser beam and the second laser beam are incident thereon, said single lens being configured to deflect the first laser beam and the second laser beam.

8. The semiconductor laser module according to claim 7 , wherein said first stripe and said second stripe are arranged with a spacing not more than 100 .mu.m.

9. The semiconductor laser module according to claim 6 , further comprising a prism fixed to the holder member, said prism being positioned so that the first laser beam and the second laser beam emerging from said single lens are incident thereon and emitted toward the polarization synthesizing element along respective optical axes parallel to each other.

10. The semiconductor laser module according to claim 1 , wherein said first stripe and said second stripe are formed on discrete semiconductor substrates to form discrete semiconductor laser devices.

11. The semiconductor laser module according to claim 10 , further comprising a mirror configured to reflect one of the first laser beam and the second laser beam toward the optical synthesizing element said mirror being fixed to the holder member.

12. The semiconductor laser module according to claim 6 , wherein said at least one first lens consists of two lenses on which the first laser beam and the second laser beam are respectively incident.

13. The semiconductor laser module according to claim 10 , wherein said at least one first lens consists of two lenses on which the first laser beam and the second laser beam are respectively incident.

14. The semiconductor laser module according to claim 11 , wherein said at least one first lens consists of two lenses on which the first laser beam and the second laser beam are respectively incident.

15. The semiconductor laser module according to claim 12 , wherein said two lenses are formed in a lens array.

16. The semiconductor laser module according to claim 13 , wherein said two lenses are formed in a lens array.

17. The semiconductor laser module according to claim 14 , wherein said two lenses are formed in a lens array.

18. A manufacturing method of a semiconductor laser module, said method comprising:

aligning an optical synthesizing element such that beam spots of a first laser beam and a second laser beam emitted respectively from a first stripe and a second stripe formed on a semiconductor substrate overlap on an output part of the optical synthesizing element to be emitted as a combined laser beam therefrom;

fixing a substantially columnar peripheral outer surface of a holder member holding the optical synthesizing element around a center axis of the optical synthesizing element; and

fixing a supporting member so as to support said optical synthesizing element at the substantially columnar peripheral outer surface of the holder member, said supporting member including a bottom plate joined to said substrate and two mutually parallel upright walls provided perpendicularly on both lateral ends of the bottom plate, the two upright walls being parallel to the center axis of the optical synthesizing element, wherein said optical synthesizing module is fixed to supporting member in a state that the columnar peripheral surface of the holder member is placed between the two upright walls of said supporting member.

19. The method according to a claim 18 , wherein said aligning the optical synthesizing element includes adjusting a position of the optical synthesizing element at least one of along the center axis of the holder member, around the center axis of the holder member, and around a direction orthogonal to the center axis of the holder member and in parallel to a mounting surface on which the semiconductor substrate is mounted.

20. The method according to claim 18 , wherein said aligning the optical synthesizing element includes adjusting a position of the optical synthesizing element such that the first laser beam and the second laser beam overlap on an imaginary reference plane set between the output part and an optical fiber to which the combined laser beam is to be coupled.

21. The method according to claim 18 , wherein said aligning the optical synthesizing element includes adjusting a position of the optical synthesizing element such that an intensity coupled to a dummy fiber positioned so as to receive the combined laser beam emerging from the output part of the optical synthesizing element is maximized.

Assignments (3)
CORRECTIVE COVERSHEET TO CORRECT ASSIGNOR #2'S NAME PREVIOUSLY RECORDED ON REEL/FRAME 016170/0166. Recorded Aug 30, 2005
From: NAKAE, MASASHI; KIMURA, TOSHIO
To: FURUKAWA ELECTRIC CO., LTD.
Reel/Frame 016935/0163 →
RECORD TO CORRECT ASSIGNOR #1'S DOCUMENT DATE ON AN ASSIGNMENT PREVIOUSLY RECORDED ON REEL/FRAME 015491/0446. Recorded Jan 21, 2005
From: NAKAE, MASASHI; KIMURA, TOSHOI
To: FURUKAWA ELECTRIC CO., LTD., THE
Reel/Frame 016170/0166 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2004
From: NAKAE, MASASHI; KIMURA, TOSHIO
To: FURUKAWA ELECTRIC CO., LTD., THE
Reel/Frame 015491/0446 →
Priority Claims (5)
JP 2001-201513 · Jul 2, 2001 · national
JP 2001-217266 · Jul 17, 2001 · national
JP 2001-325707 · Oct 23, 2001 · national
JP 2002-102479 · Apr 4, 2002 · national
JP 2002-145422 · May 20, 2002 · national
Continuity (2)
Continuation PCTJP020667900 · Jul 2, 2002
Related Publication 20040213305A1 · Oct 28, 2004