Metal interconnect structure for integrated circuits and a design rule therefor
View Patent ↗A method is provided for designing an integrated circuit having an interconnect structure with a reduced lateral dimension relative to a pre-existing interconnect structure layout. The method begins by reducing in scale by a desired amount the lateral dimension of a given level of metallization in the pre-existing interconnect structure layout by reducing the width of each conductive line in the given level of metallization to a prescribed width. The conductive lines are separated by dielectric material. The given level of metallization in the interconnect structure layout is divided into at least first and second levels of metallization by arranging in the second level of metallization alternating lines from the given level. The prescribed width in the lateral direction of each line is increased in the first and second levels of metallization by a factor of at least two. The layout of lines in the second level of metallization is arranged so that they partially overlap in the vertical direction one of the lines in the first level of metallization.
1. A method for designing an integrated circuit having an interconnect structure with a reduced lateral dimension relative to a pre-existing interconnect structure layout, comprising:
reducing in scale by a desired amount the lateral dimension of a given level of metallization in the pre-existing interconnect structure layout by reducing the width of each conductive line in the given level of metallization to a prescribed width, said conductive lines being separated by dielectric material;
dividing the given level of metallization in the interconnect structure layout into at least first and second levels of metallization by arranging in the second level of metallization alternating lines from the given level;
increasing the prescribed width in the lateral direction of each line in the first and second levels of metallization by a factor of at least two; and
arranging the layout of lines in the second level of metallization so that they partially overlap in the vertical direction one of the lines in the first level of metallization.
2. The method of claim 1 wherein at least a subset of the lines in the given level of metallization each have conductive vias vertically extending therefrom.
3. The method of claim 2 wherein a subset of lines in the second level of metallization have a recess for preventing an electrical short with one of the vertically extending vias that is adjacent thereto.
4. The method of claim 1 wherein said interconnect structure is a dual damascene structure.
5. An integrated circuit formed in accordance with the reduced lateral dimension design set forth in claim 1 .
6. The integrated circuit of claim 5 wherein said interconnect structure is a dual damascene structure.
7. The integrated circuit of claim 5 wherein at least a subset of the lines in the given level of metallization each have conductive vias vertically extending therefrom.
8. The integrated circuit of claim 7 wherein a subset of lines in the second level of metallization have a recess for preventing an electrical short with one of the vertically extending vias that is adjacent thereto.