Reactive hot melt adhesive
The invention is a reactive hot melt composition which has excellent adhesion and curing properties, and can be formulated into free-flowing pellets or beads, by using an ethylene-acrylic acid copolymer, and athylene-methacrylic acid copolymer, and/or an ethylene-acrylic acid methacrylic acid terpolymer as a component of the composition along with free radical crosslinking initiators. The incorporation of a foaming agent enables the production of compositions which are useful in space-filling applications, (i.e., as so-called “anti-flutter” compositions).
1. A reactive hot melt composition in the form of free-flowing pellets, the composition comprising:
a cross-linkable resin comprising, one of an ethylene-acrylic acid copolymer, an ethylene-methacrylic acid copolymer, and an ethylene-acrylic acid-methacrylic acid terpolymer, having a melt flow rate, when measured according to ISO 1113, of more than 100 g/10 minutes at 190° C. and 2.16 kg, said cross-linkable resin further comprising at least one or more additional copolymers of ethylene with an ethylenically unsaturated monomer;
from about 10 to about 30 percent based on the total weight of the composition, of an adhesion promoter for providing adhesive properties to the composition at temperatures of about 50 to about 100° C., wherein the adhesion promoter comprises at least one of a plasticizer and a tackifier;
a free radical cross-linking initiator having a 1 hour half-life temperature of from about 110° C. to about 170° C.; and
a foaming agent;
wherein the composition is such that it can be melted and extruded on to a substrate at a temperature of from about 90° C. to about 120° C. without curing, and can be cured at a temperature of from about 120° C. to about 200° C.
2. A composition as claimed in claim 1 , wherein the said resin constitutes from about 37 to about 60 percent based on the total weight of the composition.
3. A composition as claimed in claim 1 , wherein one or more of ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, and ethylene-acrylic acid-methacrylic acid terpolymer is present in an amount of from about 10 to about 40 percent based on the weight of the total composition.
4. A composition as claimed in claim 1 , wherein the free radical cross-linking initiator is a peroxide.
5. A composition as claimed in claim 1 , wherein the adhesion promoter comprises both a plasticizer and a tackifier.
6. A composition as claimed in claim 1 , wherein the resin comprises one or more of a terpolymer containing acrylate and/or methacrylate units, a maleic anhydride grafted elastomer, an ethylene-acrylate-glycidyl methacrylate polymer, an ethylene-acrylate-maleic anhydridc polymer, an ethylene-vinyl acetate-maleic anhydride polymer, an ethylene-vinyl acetate copolymer, an ethylene-methylacrylic ester copolymer, an ethylene-ethylacrylic ester copolymer, a ethylene-butylacrylic ester copolymer and a rubber.
7. A composition as claimed in claim 6 , wherein one or more of the methacrylate- and acrylate-containing copolymers or terpolymers is present in a total amount of up to about 30 percent, based on the total weight of the composition.
8. A composition as claimed in claim 1 , wherein the foaming agent is present in an amount of from about 0.1 percent to about 4 percent by weight, based on the total composition.
9. A composition as claimed in claim 8 , wherein the composition expands from about 150 to about 250 percent on curing.
10. A reactive hot melt composition according to claim 1 wherein an ethylenic-acrylic acid copolymer is present in the resin.
11. A reactive hot melt composition according to claim 1 wherein melt flow rate of the ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, or ethylene acrylic acid methacrylic acid terpolymer is 300 to about 1,300.
12. A reactive hot melt composition according to claim 1 wherein the pellets are coated with a powder comprising a filler applied in an amount of from about 0.2 to about 2 percent based on the weight of the composition.
13. A reactive hot melt composition according to claim 10 wherein the additional copolymers of ethylene with an ethylenically unsaturated monomer comprises ethylene vinyl acetate.
14. A reactive hot melt according to claim 8 wherein the additional copolymers of ethylene with an ethylenically unsaturated monomer is present in an amount of up to 25 percent by weight based on the total composition.
15. A composition according to claim 12 wherein the filler is an inorganic mineral.
16. A composition according to claim 15 wherein the filler is calcium carbonate, magnesium silicate or calcium silicate.
17. A composition according to claim 5 wherein the tackifier is present in an amount of about 7 to about 21 percent and the plasticizer is present in an amount of about 2 to about 7 percent by weight based on the total composition.
18. A composition according to claim 17 which cures at a temperature of from about 140° C. to about 200° C.
19. A reactive hot melt composition in the form of free-flowing pellets, the composition comprising:
a) from about 37 to about 60 percent based on the total weight of the composition of a cross-linkable resin including one or more of an ethylene-acrylic acid copolymer, an ethylene-methacrylic acid copolymer, and an ethylene-acrylic acid-methacrylic acid terpolymer having a melt flow rate, when measured according to ISO 1113 of more than 100 g/10 minutes at 190° C. and 2.16 kg said cross-linkable resin further comprising at least one additional copolymer of ethylene with an ethylenically unsaturated monomer,
b) from about 10 to about 30 percent based on the total weight of the composition of an adhesion promoter for providing adhesive properties to the composition at temperatures of from about 50° C. to about 100° C., wherein the adhesion promoter comprises at least one of a plasticizer and a tackifier;
c) from about 0.5 to about 3 percent based on the total weight of the composition of a free radical crosslinking initiator having a 1 hour half-life temperature of from about 110° C. to 170° C.; and
d) from about 10 to about 40 percent based on the total weight of the composition of a filler;
e) from about 0.1 to about 4 percent based on the total weight of the composition of a foaming agent;
wherein the composition is such that it can be melted and extruded on to a substrate at a temperature of from about 90° C. to about 120° C. without curing, and can be cured at a temperature of from about 120° C. to about 200° C.
20. A reactive hot melt composition according to claim 19 wherein an ethylenic acrylic acid is present in the resin.
21. A reactive hot melt composition according to claim 19 wherein melt flow rate of the ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, or ethylene acrylic acid methacrylic acid terpolymer is about 300 to about 1,300.
22. A reactive hot melt composition according to claim 19 wherein the pellets are coated with a powder comprising a filler applied in an amount of from about 0.2 to about 2 percent based on the weight of the composition.
23. A reactive hot melt composition according to claim 20 wherein the additional copolymers of ethylene with an ethylenically unsaturated monomer comprises ethylene vinyl acetate.
24. A reactive hot melt according to claim 23 wherein the additional copolymers of ethylene with an ethylenically unsaturated monomer is present in an amount of up to 25 percent by weight based on the total composition.
25. A composition according to claim 22 wherein the filler is an inorganic mineral.
26. A composition according to claim 25 wherein the filler is calcium carbonate, magnesium silicate or calcium silicate.
27. A method of preparing a pelletized reactive hot melt composition adhesive composition as claimed in claim 1 or claim 19 , comprising:
compounding the components of the composition; and
pelletizing the resulting composition to produce a dry free flowing material.
28. A method as claimed in claim 27 , wherein the components are compounded at a temperature of less than about 150° C.
29. A method of adhering a first component to a second component, comprising the steps of melting a composition as claimed in claim 1 or claim 19 at about 90° C. to about 120° C., contacting the first and second components with the melted composition; and applying heat to cure the composition at a temperature of about 120° C. to about 200° C.
30. A method according to claim 29 wherein the composition is cured at about 140° C. to about 200° C.
31. A method according to claim 27 which further comprises coating the pellets with a powder comprising a filler.
32. A reactive hot melt composition in the form of free-flowing pellets, the composition comprising:
a cross-linkable resin comprising, one or more of an ethylene-acrylic acid copolymer, an ethylene-methacrylic acid copolymer, and an ethylene-acrylic acid-methacrylic acid terpolymer having a melt flow rate, when measured according to ISO 1113, of more than 100 g/10 minutes at 190° C. and 2.16 kg said cross-linkable resin further comprising at least one or more additional copolymers of ethylene with an ethylenically unsaturated monomer:
from about 10 to about 30 percent based on the total weight of the composition, of an adhesion promoter for providing adhesive properties to the composition at temperatures of about 50° C. to about 100° C., wherein the adhesion promoter comprises at least one of a plasticizer and a tackifier;
a free radical crosslinking initiator having a 1 hour half-life temperature of from about 110 to about 170° C.; and
a filler;
wherein the composition is such that it can be melted and extruded on to a substrate at a temperature of from about 90° C. to about 120° C. without curing, and can be cured at a temperture of from about 120° C. to about 200° C.
33. A composition according to claim 32 wherein the adhesion promoter comprises both a plasticizer and a tackifier.
34. A composition according to claim 33 wherein the tackifier is present in an amount of about 7 to about 21 percent and the plasticizer is present in an amount of about 2 to about 7 percent by weight based on the total composition.
35. A composition according to claim 34 which cures at a temperature of from about 140° C. to about 200° C.