IP Library Granted Patent US 7,272,006
Granted Patent B2
US 7,272,006 · App. 11/239,957 · Granted Sep 18, 2007

IC coolant microchannel assembly with integrated attachment hardware

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,272,006
App. No.
11/239,957
Granted
Sep 18, 2007
Kind
B2
Abstract

An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.

Claims (17)

1. A system comprising:

a circuit board;

a socket mounted on the circuit board;

a microprocessor integrated circuit die package installed in the socket;

a microchannel structure thermally coupled to the microprocessor integrated circuit die package, the microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to the integrated circuit die package to transfer heat from the integrated circuit die package to the coolant;

a cover positioned on the microchannel structure and above the circuit board and having formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of said cover and a second port on a vertical surface of said cover, said cover including a plurality of tabs, each extending from a respective corner of said cover, said tabs each having an aperture formed therein;

a backing plate below the circuit board and having a plurality of receptacles formed therein; and

a plurality of screws for securing the cover to the backing plate each of said screws installed in a respective one of the apertures of the cover and threadedly engaged in a respective one of the receptacles of the backing plate.

2. The system of claim 1 , wherein said right-angle passage is a first right-angle passage and said vertical surface is a first vertical surface;

said cover also having formed therein a second right-angle passage to provide fluid communication between a third port on said lower horizontal surface of said cover and a fourth port on a second vertical surface of said cover, said second vertical surface being different from said first vertical surface.

3. The system of claim 2 , wherein said cover includes a metal base plate in which said tabs are formed and a molded plastic piece secured to said base plate and having said right-angle passages formed therein.

4. The system of claim 1 , wherein the plurality of tabs include four tabs.

5. The system of claim 4 , wherein the four tabs all share an orientation.

6. The system of claim 4 , wherein each of the tabs extends radially outwardly from its respective corner of said cover.

7. The system of claim 1 , further comprising:

a gasket sandwiched between the microchannel structure and the cover.

8. The system of claim 1 , further comprising a pair of grommets sandwiched between the microchannel structure and the cover.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2005
From: MONGIA, RAJIV K.; POKHARNA, HIMANSHU; DISTEFANO, ERIC
To: INTEL CORPORATION
Reel/Frame 016957/0485 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2005
From: MCEUEN, SHAWN S.; WILK, BRIAN A.
To: INTEL CORPORATION
Reel/Frame 016963/0485 →
Continuity (1)
Related Publication 20070076374A1 · Apr 5, 2007