IP Library › Granted Patent US 7,282,739
Granted Patent B2
US 7,282,739 · App. 10/860,093 · Granted Oct 16, 2007

Silicon carbide semiconductor device

Assignee: Nissan Motor Co., Ltd.
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Quick Facts
Patent No.
US 7,282,739
App. No.
10/860,093
Granted
Oct 16, 2007
Kind
B2
Abstract

A silicon carbide semiconductor device is provided with a semiconductor substrate ( 20 ) of silicon carbide of a first conductivity type, a hetero semiconductor region ( 60 ) forming a hetero-junction with the semiconductor substrate ( 20 ), an insulated gate including a gate electrode ( 40 ) and a gate insulator layer ( 30 ) formed on the semiconductor substrate ( 20 ) and adjoining to the hetero semiconductor region ( 60 ), a source electrode ( 80 ) electrically connected to the hetero semiconductor region ( 60 ) and a drain electrode ( 90 ) electrically connected to the semiconductor substrate ( 20 ).

Claims (21)

1. A silicon carbide semiconductor device comprising:

a semiconductor substrate of silicon carbide of a first conductivity type;

a hetero semiconductor region forming a hetero-junction with the semiconductor substrate;

an insulated gate including a gate electrode and a gate insulator layer formed on the semiconductor substrate and adjoining to the hetero-junction;

a source electrode electrically connected to the hetero semiconductor region; and

a drain electrode electrically connected to the semiconductor substrate, wherein

the semiconductor substrate includes a second conductivity type region in contact with the gate insulator layer.

2. The silicon carbide semiconductor device of claim 1 , wherein:

the hetero semiconductor region further includes a second hetero semiconductor region having a different impurity concentration from the hetero semiconductor region.

3. The silicon carbide semiconductor device of claim 1 , wherein:

the hetero semiconductor region comprises a material selected from the group of silicon, amorphous silicon and polycrystalline silicon.

4. A silicon carbide semiconductor device comprising:

a semiconductor substrate of silicon carbide of a first conductivity type;

a hetero semiconductor region forming a hetero-junction with the semiconductor substrate;

an insulated gate including a gate electrode and a gate insulator layer formed on the semiconductor substrate and adjoining to the hetero-junction;

a source electrode electrically connected to the hetero semiconductor region; and a drain electrode electrically connected to the semiconductor substrate, wherein

the semiconductor substrate further includes a second semiconductor region of a first conductivity type, the second semiconductor region having a different impurity concentration from the semiconductor substrate, so as to form a second hetero-junction with the hetero semiconductor region.

5. The silicon carbide semiconductor device of claim 4 , wherein

the hetero semiconductor region further includes a second hetero semiconductor region having a different impurity concentration from the hetero semiconductor region.

6. The silicon carbide semiconductor device of claim 4 , wherein

the hetero semiconductor region comprises a material selected from the group of silicon, amorphous silicon and polycrystalline silicon.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2004
From: KANEKO, SAICHIROU
To: NISSAN MOTOR CO., LTD.
Reel/Frame 015432/0838 →
Continuity (1)
Related Publication 20040217358A1 · Nov 4, 2004