Method of forming a solution processed device
View Patent ↗Embodiments of methods, apparatuses, devices, and/or systems for forming a solution processed device are described.
1. A method, comprising: depositing a first material over at least a portion of a substrate by use of one or more solution processes to form a first material layer, at least a portion of said first material layer comprising inorganic dielectric material;
depositing a second material over and/or in contact with said at least a portion of said first material layer by use of one or more solution processes to form a second material layer, at least a portion of said second material layer comprising organic dielectric material, to form at least a portion of a dielectric device layer; and
wherein the inorganic dielectric material is formed from nanoparticles of silicon dioxide suspended in a solvent of water, glycol, and/or alcohol.
2. The method of claim 1 , and further comprising: altering said at least a portion of said first and/or said second material layer at least in part.
3. The method of claim 2 , wherein said altering substantially comprises one or more of: solidification, ablation, crystallization, removal, curing, polymerization, densification, and/or patterning.
4. The method of claim 1 , wherein said depositing said first material and said depositing said second material substantially comprises differing processes.
5. The method of claim 1 , wherein said one or more solution processes comprises one or more of the following: an ejection process, a spin coating process, a contact printing process, a dip-coating process, a spray coating process, a curtain coating process, a screen printing process, and/or a chemical bath deposition.
6. The method of claim 5 , wherein said one or more solution processes comprises successive ionic layer absorption and/or reaction.
7. The method of claim 5 , wherein said ejection process is substantially performed by an ejection device.
8. The method of claim 7 , wherein said ejection device comprises a thermal ink jet (TIJ) device.
9. The method of claim 1 , wherein said inorganic dielectric material further includes one or more of: zirconium oxide, tin oxide, titanium oxide, tantalum oxide, yttrium oxide, lanthanum oxide, silicon oxide, aluminum oxide, hafnium oxide, barium zirconate titanate, barium strontium titanate, silicon nitride, and/or silicon oxynitride.
10. The method of claim 9 , wherein said inorganic dielectric material is formed to a thickness approximately in the range of 1-500 nm.
11. The method of claim 9 , wherein said inorganic dielectric material further includes zirconium oxide and is formed to a thickness approximately in the range of 20-100 nm.
12. The method of claim 1 , wherein said organic dielectric material substantially comprises one or more of: UV curable acrylic monomer, acrylic polymer, a UV curable monomer, a thermal curable monomer, a polymer solution, a melted polymer, an oligomer solution, a poly methyl methacrylate, a poly vinyiphenol, and/or a benzocyclobutene.
13. The method of claim 12 , wherein said organic dielectric material substantially comprises one or more polyimides.
14. The method of claim 12 , wherein said organic dielectric material is formed to a thickness approximately in the range of 50-5000 nm.
15. The method of claim 12 , wherein said organic dielectric material substantially comprises a UV curable acrylic monomer, and is formed to a thickness approximately in the range of approximately 200-2000 nm.
16. The method of claim 1 , wherein at least one of said first and said second materials comprises a solution of particles at least paztially suspended in a solvent.
17. The method of claim 16 , wherein the said first material comprises nanoparticles of SiO 2 suspended in a solution of water, glycol and/or alcohol, said nanoparticles of SiO 2 having a diameter of approximately 20 nanometers, and comprising approximately 15-30% of said solution by weight.
18. The method of claim 1 , wherein said substrate substantially comprises at least a portion of a thin film transistor.
19. A method, comprising: a step for depositing a first material over at least a portion of a substrate by use of one or more steps for solution processing, at least a portion of said first material comprising inorganic dielectric material;
a step for curing said first material;
a step for depositing a second material over said at least a portion of said first material by use of one or more steps for solution processing, at least a portion of said second material comprising organic dielectric material, such as to form at least a portion of a dielectric device layer of a thin film device; and
wherein the dielectric device layer allows for a drain current that varies based on a varying gate to source voltage, while a gate current leakage does not vary proportionally to the drain current based on the varying gate to source voltage in the thin film device.
20. The method of claim 19 , wherein said step for depositing said first material and said step for depositing said second material substantially comprises one or more differing processing steps.
21. The method of claim 19 , wherein said one or more steps for solution processing comprises one or more of the following: an ejection process, a spin coating process, a contact printing process, a dip-coating process, a spray coating process, a curtain coating process, a screen printing process, a chemical bath deposition, and/or successive ionic layer absorption and/or reaction.
22. The method of claim 21 , wherein said ejection processes is substantially performed by an ejection device.
23. The method of claim 22 , wherein said ejection device comprises a thennal ink jet (TIJ) device.
24. The method of claim 19 , wherein said inorganic dielectric material substantially comprises one or more of: zirconium oxide, tin oxide, titanium oxide, tantalum oxide, yttrium oxide, lanthanum oxide; silicon oxide, aluminum oxide, hafnium oxide, barium zirconate titanate, barium strontium titanate, silicon nitride, and/or silicon oxynitride.
25. The method of claim 19 , wherein said organic dielectric material substantially comprises one or more of: UV curable acrylic monomer, acrylic polymer, a UV curable monomer, a thermal curable monomer, a polymer solution, a melted polymer, an oligomer solution, a poly methyl methacrylate, a poly vinyiphenol, and/or a benzocyclobutene.
26. The method of claim 25 , wherein said organic dielectric material substantially comprises one or more polyimides.
27. The method of claim 19 , wherein at least one of said first and said second materials comprises a solution of particles at least partially suspended in a solvent.
28. The method of claim 19 , wherein said first material comprises nanoparticles of SiO 2 suspended in a solvent of water, glycol and/or alcohol, said nanoparticles of SiO 2 having a diameter of approximately 20 nanometers, and comprising approximately 15-30% of said solution by weight.
29. The method of claim 19 , wherein said substrate substantially comprises at least a portion of a thin film transistor.