Light emitting device and method of fabricating the same
View Patent ↗It is characteristic of an organic material suited to an interlayer insulating film to transmit vapor therethrough and to be liable to absorb moisture, and the material has a disadvantage that it is extremely susceptible to oxygen and moisture to be readily deteriorated no matter whether it is low-molecular or high-molecular. Further, alkali metal or alkaline earth metal is used for a positive electrode or a negative electrode of a light emitting element, and these are liable to be oxidized by oxygen. Thus moisture is responsible for deterioration of a light emitting element and for failure such as dark spots or the like. A light emitting device is provided to comprise an interlayer insulating film comprising a high molecular chemical compound and formed on a TFT formed on an insulating surface, a light emitting element, which is provided on the interlayer insulating film, and in which a light emitting layer comprising an organic chemical compound is formed between a pair of electrodes, and an inorganic insulating film containing silicon and nitrogen as its main components or a carbon film possessing a SP 3 coupling and containing hydrogen formed between the interlayer insulating film and the light emitting element.
1. A method of fabricating a light emitting device comprising:
forming an interlayer insulating film, which comprises an organic material, over a thin film transistor, wherein the thin film transistor includes a semiconductor film, a gate insulating film, and a gate electrode;
forming an inorganic insulating film on the interlayer insulating film by sputtering at a temperature of 150° C. to 250° C., the inorganic insulating film comprising silicon at a content at least 25.0 atomic % and at most 35.0 atomic % and nitrogen at a content at least 35.0 atomic % and at most 65.0 atomic %; and
forming a light emitting element, which has a light emitting layer between a pair of electrodes, over the inorganic insulating film.
2. A method according to claim 1 , wherein the interlayer insulating film comprising an organic material is formed by means of a coating method.
3. A method according to claim 1 , wherein the light emitting device comprises an EL display device.
4. A method according to claim 1 , wherein the light emitting device is used in an electronic equipment selected from the group consisting of personal computers, video cameras, portable type information terminals, digital cameras, digital video disk players, and projectors.
5. A method of fabricating a light emitting device comprising:
forming an interlayer insulating film, which comprises an organic material, over a thin film transistor, wherein the thin film transistor includes a semiconductor film, a gate insulating film, and a gate electrode;
forming an inorganic insulating film on the interlayer insulating film by sputtering at a temperature of 150° C. to 250° C., the inorganic insulating film comprising silicon at a content at least 25.0 atomic % and at most 35.0 atomic % and nitrogen at a content of at least 35.0 atomic % and at most 65.0 atomic %;
forming an electrode over the inorganic insulating film; and
forming a light emitting layer comprising an organic material over the electrode.
6. A method according to claim 5 , wherein the interlayer insulating film comprising an organic material is formed by means of a coating method.
7. A method according to claim 5 , wherein the light emitting device comprises an EL display device.
8. A method according to claim 5 , wherein the light emitting device is used in an electronic equipment selected from the group consisting of personal computers, video cameras, portable type information terminals, digital cameras, digital video disk players, and projectors.
9. A method of fabricating a light emitting device comprising:
forming an interlayer insulating film comprising an organic material over a thin film transistor, wherein the thin film transistor includes a semiconductor film, a gate insulating film, and a nate electrode;
forming an inorganic insulating film comprising silicon and nitrogen over the interlayer insulating film by sputtering at a temperature of 150° C. to 250° C., wherein a composition ratio of nitrogen is higher than a composition ratio of oxygen in the film; and
forming a light emitting element comprising a light emitting layer between a pair of electrodes, over the inorganic insulating film.
10. A method according to claim 9 , wherein the interlayer insulating film comprising an organic material is formed by means of a coating method.
11. A method according to claim 9 , wherein the light emitting device comprises an EL display device.
12. A method according to claim 9 , wherein the light emitting device is used in an electronic equipment selected from the group consisting of personal computers, video cameras, portable type information terminals, digital cameras, digital video disk players, and projectors.
13. A method of fabricating a light emitting device comprising:
forming an interlayer insulating film comprising an organic material over a thin film transistor, wherein the thin film transistor includes a semiconductor film, a gate insulating film, and a gate electrode;
forming an inorganic insulating film comprising silicon and nitrogen over the interlayer insulating film by sputtering at a temperature of 150° C. to 250° C., wherein a composition ratio of nitrogen is higher than a composition ratio of oxygen in the film;
forming an electrode over the inorganic insulating film; and
forming a light emitting layer comprising an organic material over the electrode.
14. A method according to claim 13 , wherein the interlayer insulating film comprising an organic material is formed by means of a coating method.
15. A method according to claim 13 , wherein the light emitting device comprises an EL display device.
16. A method according to claim 13 , wherein the light emitting device is used in an electronic equipment selected from the group consisting of personal computers, video cameras, portable type information terminals, digital cameras, digital video disk players, and projectors.
17. A method of fabricating a light emitting device comprising:
forming an interlayer insulating film comprising an organic material over a thin film transistor, wherein the thin film transistor includes a semiconductor film, a gate insulating film, and a gate electrode;
forming an inorganic insulating film comprising silicon and nitrogen over the interlayer insulating film by sputtering using a sputtering gas including N 2 , H 2 , and N 20 ; and
forming a light emitting element comprising a light emitting layer between a pair of electrodes, over the inorganic insulating film.
18. A method according to claim 17 , wherein the interlayer insulating film comprising an organic material is formed by means of a coating method.
19. A method according to claim 17 , wherein the light emitting device comprises an EL display device.
20. A method according to claim 17 , wherein the light emitting device is used in an electronic equipment selected from the group consisting of personal computers, video cameras, portable type information terminals, digital cameras, digital video disk players, and projectors.
21. A method according to claim 17 , wherein the inorganic insulating film is formed at a temperature of 150° C. to 250° C.
22. A method of fabricating a light emitting device comprising:
forming an interlayer insulating film comprising an organic material over a thin film transistor, wherein the thin film transistor includes a semiconductor film, a gate insulating film, and a gate electrode;
forming an inorganic insulating film comprising silicon and nitrogen over the interlayer insulating film by sputtering using a sputtering gas including N 2 and Ar; and
forming a light emitting element comprising a light emitting layer between a pair of electrodes, over the inorganic insulating film.
23. A method according to claim 22 , wherein the interlayer insulating film comprising an organic material is formed by means of a coating method.
24. A method according to claim 22 , wherein the light emitting device comprises an EL display device.
25. A method according to claim 22 , wherein the light emitting device is used in an electronic equipment selected from the group consisting of personal computers, video cameras, portable type information terminals, digital cameras, digital video disk players, and projectors.
26. A method according to claim 22 , wherein the inorganic insulating film is formed at a temperature of 150° C. to 250° C.