Distortion and shock resistant optical device module for image capture
A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.
1. An optical device module, comprising:
an image sensing unit comprising:
a solid-state image sensor having a pixel area;
a transparent lid disposed so as to be opposed to the pixel area;
a bonding portion that bonds the transparent lid to the solid-sate image sensor; and
a sealing portion that seals the solid-state image sensor and the transparent lid in a resin in such a manner that part or all of the transparent lid is exposed;
an optical path delimiter that has an optical material and a holder holding the optical material, and delimits an optical path to the pixel area; and
fixing means for fixing the optical path delimiter to the image sensing unit by bringing the holder into contact with a part of the transparent lid exposed out of the sealing portion;
wherein the fixing means comprises:
a screw portion provided on the sealing portion; and,
a screw hole portion provided on the optical path delimiter engaged with the screw portion such that
the screw portion and the screw hole portion engaged together to thereby fix the optical path delimiter to the image sensing unit.
2. The optical device module according to claim 1 , wherein
the screw portion is formed integrally with the sealing portion.
3. The optical device module according to claim 1 , wherein
the image sensing unit has:
a wiring board where a conductor wiring is formed; and
a signal processor fixed to the wring board and electrically connected to the conductor wiring; and
the sealing portion seals the wiring board and the signal processor in the resin together with the solid-state-image sensor and the transparent lid.
4. The optical device module according to claim 3 , wherein
the screw portion is made of resin, and formed integrally with the sealing portion.
5. The optical device module according to claim 1 , wherein
the holder has a positioning portion that determines relative positions of the holder and the transparent lid.
6. The optical device module according to claim 5 wherein
the transparent lid has a plate form, and one surface thereof and part or all of a side surface thereof are exposed out of the sealing portion, and
the positioning portion has a claw that engages with at least two parts of a side surface of the transparent lid when the holder is in contact with one surface of the transparent lid.
7. The optical device module according to claim 1 wherein
the optical path delimiter has:
an elastic material affixed to the holder; and
a supporter that supports the elastic material,
such that when the optical path delimiter is fixed to the image sensing unit, the elastic material presses the holder against the transparent lid.
8. The optical device module according to claim 7 , wherein
the supporter supports the elastic material so that the elastic material is movable relative to the supporter.
9. The optical device module according to claim 1 , wherein
the holder is out of contact with the sealing portion when the optical path delimiter is fixed to the image sensing unit.