Method and device for transferring a pattern from stamp to a substrate
The invention relates to a method for transferring a pattern from a stamping surface ( 31 ) of a stamp ( 30 ) to a receiving surface ( 21 ) of a substrate ( 20 ). The pattern is transferred to the receiving surface ( 21 ) by successively bringing portions of the pattern within such a range of the receiving surface ( 21 ) during a certain period, that the pattern is locally transferred from the stamping surface ( 31 ) to the receiving surface ( 21 ). The individual portions can be moved by means of individual actuators ( 50 ). By applying the method, the transfer of the pattern can be performed according to a wave, which is for example ring-shaped, moving from the center of the receiving surface ( 21 ) to the circumference, or linear, moving from side of the receiving surface ( 21 ) to an opposite side.
1. A method for transferring a pattern to a receiving surface of a substrate, in which a stamp having a stamping surface is utilized, at least one of the stamping surface and the receiving surface being flexible, the method comprising the following steps:
positioning the stamp and the substrate with respect to each other, in such a way that the stamping surface and the receiving surface face each other;
fixing the positions of the stamp and the substrate with respect to each other in a direction in which the receiving surface extends;
moving a first portion of at least one of the stamping surface and the receiving surface forward and backward in a direction substantially perpendicular to the receiving surface, such that during a first transfer period a first transfer area is created between the stamping surface and the receiving surface, in which the stamp is able to locally transfer the pattern to the substrate; and
subsequently moving a second portion of at least one of the stamping surface and the receiving surface forward and backward in a direction substantially perpendicular to the receiving surface, such that during a second transfer period a second transfer area is created between the stamping surface and the receiving surface, in which the stamp is able to locally transfer the pattern to the substrate.
2. The method of claim 1 , wherein the duration of the first transfer period and the duration of the second transfer period are substantially equal to each other.
3. The method of claim 2 , wherein the first transfer period and the second transfer period partly overlap.
4. The method of claim 1 , wherein the first portion and the second portion are adjacent portions.
5. The method of claim 1 , wherein the pattern is provided at the stamping surface of the stamp.
6. The method of claim 1 , wherein at least the second transfer area is shaped like a ring.
7. The method of claim 1 , wherein the first transfer area and the second transfer area are linear.
8. The method of claim 1 , wherein the first portion and the second portion are successively subjected to pressure in order to successively move the first portion and the second portion.
9. A method of manufacturing an electronic device comprising the step of transferring a pattern to a receiving surface of a substrate as claimed in claim 1 .