Support body for semiconductor element, method for manufacturing the same and semiconductor device
A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the semiconductor element, wherein at least a part of a top face of a recess side wall is covered by a resin, thereby providing a light emitting device.
1. A method of manufacturing a support body capable of supporting a semiconductor element, comprising:
making a ceramic substrate by stacking ceramic sheets having electrical conductors thereon;
forming a groove in a surface of said ceramic substrate;
disposing said ceramic substrate on two stages, which can move in opposite directions relative to each other, so as to bridge said two stages; and
cleaving said ceramic substrate along said groove by applying a bending moment to said ceramic substrate.
2. The method according to claim 1 , wherein
forming a groove in a surface of said ceramic substrate comprises incising said ceramic substrate.
3. The method according to claim 2 , wherein
applying a bending moment to said ceramic substrate comprises bringing a cleaving tool into contact with a surface of said ceramic substrate, opposite to said surface having said groove therein, at a position corresponding to said groove.
4. The method according to claim 3 , wherein
cleaving said ceramic substrate further comprises moving said two stages in said opposite directions while said cleaving tool is in contact with said surface of said ceramic substrate that is opposite to said surface having said groove therein.
5. The method according to claim 4 , wherein
each of said two stages includes an elastic body such that bringing said cleaving tool into contact with said surface of said ceramic substrate that is opposite to said surface having said groove therein results in each said elastic body deforming.
6. The method according to claim 5 , further comprising:
adhesively joining said ceramic substrate to said each said elastic body via an adhesive sheet positioned between said each said elastic body and said surface of said ceramic substrate having said groove therein.
7. The method according to claim 2 , wherein
applying a bending moment to said ceramic substrate comprises applying said bending moment such that said surface of said ceramic substrate having said groove therein becomes concave, whereby side walls defining said groove contact one another.
8. The method according to claim 2 , wherein
said groove is one of lateral and longitudinal grooves in a front surface of said ceramic substrate, with through holes being at intersections of said lateral and longitudinal grooves.
9. The method according to claim 2 , wherein
said groove extends along through holes in said ceramic substrate.
10. The method according to claim 1 , wherein
forming a groove in a surface of said ceramic substrate comprises incising said ceramic substrate and then firing said ceramic substrate, with said groove extending to a depth that is within a range of from ¼ to ¾ a thickness of said ceramic substrate.
11. The method according to claim 2 , wherein
making a ceramic substrate by stacking ceramic sheets having electrical conductors thereon results in said ceramic substrate having a recess therein,
forming a groove in a surface of said ceramic substrate comprises forming said groove in a side wall adjacent said recess, and
cleaving said ceramic substrate along said groove results in a support body having an electrical conductor exposed on a cleavage surface and an electrical conductor in said recess.
12. The method according to claim 1 , wherein
applying a bending moment to said ceramic substrate comprises bringing a cleaving tool into contact with a surface of said ceramic substrate, opposite to said surface having said groove therein, at a position corresponding to said groove.
13. The method according to claim 12 , wherein
cleaving said ceramic substrate further comprises moving said two stages in said opposite directions while said cleaving tool is in contact with said surface of said ceramic substrate that is opposite to said surface having said groove therein.
14. The method according to claim 13 , wherein
each of said two stages includes an elastic body such that bringing said cleaving tool into contact with said surface of said ceramic substrate that is opposite to said surface having said groove therein results in each said elastic body deforming.
15. The method according to claim 14 , further comprising:
adhesively joining said ceramic substrate to said each said elastic body via an adhesive sheet positioned between said each said elastic body and said surface of said ceramic substrate having said groove therein.
16. The method according to claim 1 , wherein
cleaving said ceramic substrate further comprises moving said two stages in said opposite directions while said bending moment is being applied to said ceramic substrate.
17. The method according to claim 16 , wherein
each of said two stages includes an elastic body such that applying said bending moment to said ceramic substrate results in each said elastic body deforming.
18. The method according to claim 17 , further comprising:
adhesively joining said ceramic substrate to said each said elastic body via an adhesive sheet positioned between said each said elastic body and said surface of said ceramic substrate having said groove therein.
19. The method according to claim 1 , wherein
each of said two stages includes an elastic body such that applying said bending moment to said ceramic substrate results in each said elastic body deforming.
20. The method according to claim 19 , further comprising:
adhesively joining said ceramic substrate to said each said elastic body via an adhesive sheet positioned between said each said elastic body and said surface of said ceramic substrate having said groove therein.