Method of fabricating a flash memory device

1. A method of fabricating a flash memory device comprising:

forming mask patterns on a substrate;

etching the substrate using the mask patterns as an etch mask to form a plurality of trenches;

filling the plurality of trenches with a first insulating layer, wherein sidewalls of the mask patterns remain substantially exposed after filling the plurality of trenches with the first insulating layer;

forming a silicon nitride layer on the substrate;

performing an anisotropic dry etching process on the silicon nitride layer to form spacers on the exposed sidewalls of the mask patterns;

forming a second insulating layer on the first insulating layer to fill the plurality of trenches between the spacers to define isolation layers; and,

removing the mask patterns and spacers.

2. The method of claim 1 , wherein forming mask patterns on the substrate comprises:

forming a pad oxide layer on the substrate;

forming a pad nitride layer on the pad oxide layer; and,

patterning the pad nitride layer and the pad oxide layer.

3. The method of claim 1 , wherein each spacer has a thickness equal to about 1/10 through ⅓ of a distance between adjacent mask patterns.

4. The method of claim 3 , wherein removing the mask patterns and the spacers comprises:

removing the pad nitride layer and the spacers using a phosphoric acid solution; and,

removing the pad oxide layer through wet etching.

5. The method of claim 1 , wherein filling the trenches with a first insulating layer comprises:

partially filling insulating regions with the first insulating layer; and,

etching the first insulating layer.

6. The method of claim 1 , wherein filling the trenches with a first insulating layer comprises:

completely filling insulating regions with the first insulating layer; and,

etching the first insulating layer.

7. The method of claim 6 , wherein etching the first insulating layer comprises etching the first insulating layer until voids formed during the formation of the first insulating layer are removed.

8. The method of claim 1 , wherein sidewalls of the mask patterns remain completely exposed after filling the trenches with the first insulating layer.

9. The method of claim 1 , wherein the first insulating layer is formed from at least one layer selected from the group consisting of an HDP (high density plasma) oxide layer, a PE-TEOS (plasma enhanced-tetraethylorthosilicate) layer, and an MTO (middle temperature oxide) layer comprising an USG (undoped silicate glass) oxide layer.

10. The method of claim 1 , further comprising:

after removing the mask patterns and the spacers:

forming a tunnel oxide layer on the substrate between adjacent isolation layers; and,

forming a self-aligned floating gate on the tunnel oxide layer and between adjacent isolation layers.

11. The method of claim 10 , wherein forming the self-aligned floating gate comprises:

filling a hole between adjacent isolation layers with a doped polysilicon layer, wherein the doped polysilicon layer is formed on the substrate; and,

planarizing the doped polysilicon layer, wherein the top surface of the doped polysilicon layer is flush with the top surface of at least one isolation layer after the planarizing of the doped polysilicon layer.

12. The method of claim 10 , further comprising:

performing a wet etchback process on the isolation layers after forming the self-aligned floating gate, wherein a top surface of the self-aligned floating gate is higher than top surfaces of the isolation layers, relative to the working surface of substrate, after performing the wet etching process.

13. The method of claim 12 , further comprising:

forming an inter-gate insulating layer on the self-aligned floating gate; and,

forming a control gate on the inter-gate insulating layer.

14. The method of claim 13 , wherein the inter-gate insulating layer comprises an oxide/nitride/oxide (ONO) layer, a Ta 2 O 5 layer, or a BST layer.

15. The method of claim 13 , wherein the control gate comprises a doped polysilicon layer, a silicide layer, a doped polycide, or a metal layer.

16. A method of fabricating a flash memory device comprising:

forming mask patterns on a substrate;

etching the substrate using the mask patterns as an etch mask to form a plurality of trenches;

filling the plurality of trenches with a first insulating layer, wherein sidewalls of the mask patterns remain substantially exposed after filling the plurality of trenches with the first insulating layer;

forming spacers on the exposed sidewalls of the mask patterns;

forming a second insulating layer on the first insulating layer to fill the plurality of trenches between the spacers to define isolation layers;

removing the mask patterns and spacers, and then forming a tunnel oxide layer on the substrate between adjacent isolation layers and forming a self-aligned floating gate on the tunnel oxide layer and between adjacent isolation layers.

17. The method of claim 16 , wherein forming the self-aligned floating gate comprises:

filling a hole between adjacent isolation layers with a doped polysilicon layer, wherein the doped polysilicon layer is formed on the substrate; and,

planarizing the doped polysilicon layer, wherein the top surface of the doped polysilicon layer is flush with the top surface of at least one isolation layer after the planarizing of the doped polysilicon layer.

18. The method of claim 16 , further comprising:

performing a wet etchback process on the isolation layers after forming the self-aligned floating gate, wherein a top surface of the self-aligned floating gate is higher than top surfaces of the isolation layers, relative to the working surface of substrate, after performing the wet etching process.

19. The method of claim 18 , further comprising:

forming an inter-gate insulating layer on the self-aligned floating gate; and,

forming a control gate on the inter-gate insulating layer.