Package for electronic device, base substrate, electronic device and fabrication method thereof
A package for an electronic device includes a cavity that houses an electronic element, and grooves or holes formed on or in sidewalls that define the cavity. The grooves or holes extend from an open side of the cavity so as not to reach a bottom side of the package.
1. A package for an electronic device comprising:
a cavity that houses an electronic element; and
grooves or holes formed on or in sidewalls that define the cavity,
the grooves or holes extending from an open side of the cavity so as not to reach a bottom side of the package, further comprising:
a first conductive layer formed so as to surround an opening of the package;
second conductive layers formed on surfaces of the grooves or holes and connected to the first conductive layer; and
a wiring pattern that grounds the second conductive layers.
2. The package as claimed in claim 1 , wherein the grooves are formed on outer surfaces of the sidewalls.
3. The package as claimed in claim 1 , wherein the grooves are formed on inner surfaces of the sidewalls and extend so as not to reach a bottom of the cavity.
4. A package for an electronic device comprising:
a cavity that houses an electronic element; and
first and second grooves formed on inner surfaces of sidewalls that define the cavity, wherein:
the first grooves extend from an open side of the cavity so as not to reach a bottom side of the package;
the second grooves extend from a bottom of the cavity so as not to reach the open side of the cavity; and
the first and second grooves are arranged in zigzag form.
5. The package as claimed in claim 4 , further comprising:
a first conductive layer formed so as to surround an opening of the cavity;
second conductive layers formed on surfaces of the first grooves and connected to the first conductive layer;
third conductive layers formed on surfaces of the second grooves;
a first wiring pattern connecting the second and third conductive layers; and
a second wiring pattern that grounds the third conductive layers.
6. A package for an electronic device comprising:
a cavity that houses an electronic element; and
grooves or holes formed on or in sidewalls that define the cavity, wherein:
the grooves include first grooves formed on inner surfaces of the sidewalls and are positioned at corners of the package, and second grooves formed on inner or outer surfaces of the sidewalls;
the first grooves extend from an open side of the cavity so as not to reach a bottom side of the package;
the second grooves extend from a bottom of the cavity or the bottom of the package so as not to reach the open side of the cavity; and
the first and second grooves are arranged in zigzag form.
7. The package as claimed in claim 6 , further comprising:
a first conductive layer formed so as to surround
an opening of the cavity;
second conductive layers formed on surfaces of the first grooves and connected to the first conductive layer;
third conductive layers formed on surfaces of the second grooves;
a first wiring pattern connecting the second and third conductive layers; and
a second wiring pattern that grounds the third conductive layers.
8. An electronic device comprising:
an electronic element;
a package that houses the electronic element; and
a lid attached to the package,
the package comprising:
a cavity that houses the electronic element;
grooves or holes formed on or in sidewalls that define the cavity, the grooves or holes extending from an open side of the cavity so as not to reach a bottom side of the package;
a first conductive layer formed so as to surround an opening of the package;
second conductive layers formed on surfaces of the grooves or holes and connected to the first conductive layer; and
a wiring pattern that grounds the second conductive layers.
9. An electronic device comprising:
an electronic element;
a package that houses the electronic element; and
a lid attached to the package,
the package comprising:
a cavity that houses the electronic element; and
grooves or holes formed on or in sidewalls that define the cavity, the grooves or holes extending from an open side of the cavity so as not to reach a bottom side of the package, wherein:
the grooves include first and second grooves that are formed on inner surfaces of the sidewalls;
the first grooves extend from the open side of the cavity so as not to reach the bottom of the package;
the second grooves extend from a bottom of the cavity so as not to reach the open side of the cavity; and
the first and second grooves are arranged in zigzag form.
10. The electronic device as claimed in claim 9 , wherein the grooves are formed on inner surfaces of the sidewalls and extend so as not to reach a bottom of the cavity.
11. The electronic device as claimed in claim 9 , further comprising:
a first conductive layer formed so as to surround
an opening of the cavity;
second conductive layers formed on surfaces of the first grooves and connected to the first conductive layer;
third conductive layers formed on surfaces of the second grooves;
a first wiring pattern connecting the second and third conductive layers; and
a second wiring pattern that grounds the third conductive layers.
12. An electronic device comprising:
an electronic element;
a package that houses the electronic element; and
a lid attached to the package,
the package comprising:
a cavity that houses the electronic element; and
grooves or holes formed on or in sidewalls that define the cavity, the grooves or holes extending from an open side of the cavity so as not to reach a bottom side of the package, wherein:
the grooves include first grooves formed on inner surfaces of the sidewalls and are positioned at corners of the package, and second grooves formed on inner or outer surfaces of the sidewalls;
the first grooves extend from the open side of the cavity so as not to reach the bottom of the package;
the second grooves extend from a bottom of the cavity or the bottom of the package so as not to reach the open side of the cavity; and
the first and second grooves are arranged in zigzag form.
13. The electronic device as claimed in claim 12 , further comprising:
a first conductive layer formed so as to surround
an opening of the cavity;
second conductive layers formed on surfaces of the first grooves and connected to the first conductive layer;
third conductive layers formed on surfaces of the second grooves;
a first wiring pattern connecting the second and third conductive layers; and
a second wiring pattern that grounds the third conductive layers.