Heatsink device of video graphics array and chipset
Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.
1. A heatsink device for dissipating heat generated by thermal sources including a video graphics array and a chipset, comprising:
a heatsink pad, contacting the video graphics array to conduct the heat from the video graphics array to the heatsink pad;
a sliding block, stacked on the heatsink pad to conduct the heat from the heatsink pad to the sliding block;
at least a heat dissipation tube, installed in the sliding block to conduct the heat from the sliding block to the heat dissipation tube; and
a heatsink plate, having a video graphics array heatsink pedestal and a chipset heatsink pedestal, the video graphics array heatsink pedestal contacting the sliding block to dissipate the heat from the sliding block, and the chipset heatsink pedestal contacting the chipset to dissipate the heat from the chipset.
2. The heatsink device according to claim 1 , wherein said heatsink plate is an integrated heatsink plate.
3. The heatsink device according to claim 1 , wherein an insulator set on between said sliding block and said heatsink pad.
4. The heatsink device according to claim 1 , further comprising an elasticity element, set up at the upper surface of the video graphics array heatsink pedestal to avoid the heatsink plate oppressing on the video graphics array directly.
5. The heatsink device according to claim 1 , wherein said heatsink plate is stamped for a one-body forming.
6. The heatsink device according to claim 4 , wherein said elasticity element is a leaf spring.
7. The heatsink device according to claim 1 , wherein said sliding block is a rotatable and adjustable angle sliding block.
8. The heatsink device according to claim 5 , wherein a lower surface of said video graphics array heatsink pedestal is formed by stamping.
9. The heatsink device according to claim 5 , wherein a lower surface of said chipset heatsink pedestal is formed by stamping.