Semiconductor device
Disclosed herein is a semiconductor device having a multi-layer wiring structure includes a plurality of wiring layers laminated on a substrate, the wiring layers each including a buried wiring and a via formed by filling with a conductive material the inside of a wiring trench formed on the face side of a layer insulation film and a contact hole provided at a bottom portion of the wiring trench. The layer insulation films constituting the plurality of wiring layers are so configured that the layer insulation films are changed in the magnitude of mechanical strength alternately on a wiring layer basis in the lamination direction of the wiring layers.
1. A semiconductor device having a multi-layer wiring structure comprising a plurality of wiring layers, said wiring layers each comprising a buried wiring and a via formed by filling with a conductive material the inside of a wiring trench formed in a layer of insulation film and a contact hole provided at a bottom portion of said wiring trench, wherein
said layer insulation films of said plurality of wiring layers are so configured that said layer insulation films are changed in a magnitude of mechanical strength alternately in a lamination direction of said wiring layers, wherein
said multi-layer wiring structure has a configuration in which a first group of said wiring layers are comprised of a low-dielectric-constant film having an elastic modulus of less than 10 GPa and a second group of said wiring layers are comprised of an insulation film having an elastic modulus of not less than 10 GPa as a principal material and one member of each group is alternately laminated.
2. A semiconductor device having a multi-layer wiring structure comprising a plurality of wiring layers, said wiring layers each comprising a buried wiring and a via formed by filling with a conductive material the inside of a wiring trench formed in a layer of insulation film and a contact hole provided at a bottom portion of said wiring trench, wherein
said layer insulation films of said plurality of wiring layers are so configured that said layer insulation films are changed in a magnitude of mechanical strength alternately in a lamination direction of said wiring layers, wherein
said multi layer wiring structure has a configuration in which a first group of said wiring layers are comprised of a porous low-dielectric-constant film and a second group of said wiring layers are comprised of a non-porous inorganic insulation film and one member of each group is alternately laminated.
3. A semiconductor device having a multi-layer wiring structure comprising a plurality of wiring layers, said wiring layers each comprising a buried wiring and a via formed by filling with a conductive material the inside of a wiring trench formed in a layer of insulation film and a contact hole provided at a bottom portion of said wiring trench, wherein
said layer insulation films of said plurality of wiring layers are so configured that said layer insulation films are changed in a magnitude of mechanical strength alternately in a lamination direction of said wiring layers, wherein
said multi-layer wiring structure has a configuration in which a first group of said wiring layers are comprised of a porous carborn-containing silicon oxide film and a second group of said wiring layers are comprised of a non-porous carbon-containing silicon oxide film and one member of each group is alternately laminated.
4. A semiconductor device having a multi-layer wiring structure comprising a plurality of wiring layers, said wiring layers each comprising a buried wiring and a via formed by filling with a conductive material the inside of a wiring trench formed in a layer of insulation film and a contact hole provided at a bottom portion of said wiring trench, wherein
said layer insulation films of said plurality of wiring layers are so configured that said layer insulation films are changed in a magnitude of mechanical strength alternately in a lamination direction of said wiring layers wherein
copper is used as said conductive material constituting said buried wiring and said via which constitute each said wiring layer.