Semiconductor device having diffusion barrier layer containing chrome and method for fabricating the same
A semiconductor device is provided which is capable of preventing a constitutional material of a diffusion barrier layer from diffusing into a bottom electrode during a high thermal process and of preventing an increase in contact resistance of a contact plug by suppressing mutual diffusions of the constitutional material of the diffusion barrier layer and the contact plug and a method for fabricating the same. The semiconductor device includes a bottom electrode of a capacitor connecting to a substrate through a contact plug; a first diffusion barrier layer disposed on the contact plug, wherein the first diffusion barrier contains Cr therein for preventing mutual diffusions between the bottom electrode and the contact plug; and a second diffusion barrier on the first diffusion barrier for preventing the Cr in the first diffusion layer from diffusing into the bottom electrode; a dielectric layer disposed on the bottom electrode and a top electrode disposed on the dielectric layer.
1. A method for fabricating a semiconductor device, comprising the steps of:
forming an inter-layer insulating layer on a substrate;
forming a contact hole in the inter-layer insulating layer;
forming a contact plug connecting to the substrate through the contact hole;
forming a first diffusion barrier layer containing Cr on the contact plug and the inter-layer insulating layer;
forming a second diffusion barrier layer on the first diffusion barrier layer for preventing diffusions of the Cr in the first diffusion barrier layer; and
forming a capacitor including a bottom electrode, a dielectric layer and a top electrode on the second diffusion barrier layer,
wherein the first diffusion barrier layer includes Cr x Me 1−x N containing Cr, metal (Me) and N 2 .
2. The method as recited in claim 1 ,
wherein the second diffusion barrier layer is a material selected from the group consisting of IrO 2 , RuO 2 and SrRuO 3 .
3. The method as recited in claim 1 , wherein the step of forming the contact plug includes the steps of:
forming a tungsten layer on the inter-layer insulating layer including the contact hole; and
forming a tungsten plug in the contact hole through an etch-back process.
4. The method as recited in claim 1 , wherein the first diffusion barrier layer is Cr x Me 1−x N containing Cr, metal (Me) and N 2 .
5. The method as recited in claim 4 , wherein the metal (Me) is a substance selected from the group consisting of Ti, Ta and Al.
6. The method as recited in claim 5 , wherein the value of “x” within the Cr x Me 1−x N ranges from about 0.2 mol to about 0.8 mol.
7. The method as recited in claim 1 , further comprising:
forming an ohmic contact layer between the substrate and the contact plug; and
forming a third diffusion barrier layer for preventing a material in the contact plug from diffusing into a space between the ohmic contact layer and the contact plug.
8. The method as recited in claim 7 , wherein the third diffusion barrier layer is a material selected from the group consisting of Ti/TiN, TiN, TaN, TiAlN and TiSiN.
9. A method for fabricating a semiconductor device, comprising the steps of:
forming an inter-layer insulating layer on a substrate;
forming a contact hole in the inter-layer insulating layer;
forming a contact plug connecting to the substrate through the contact hole, wherein the contact plug partially fills the contact hole;
forming a first diffusion barrier layer containing Cr on the contact plug until completely filling the contact hole;
forming a second diffusion barrier layer on the first diffusion barrier layer and the inter-layer insulating layer for preventing diffusions of the Cr in the first diffusion barrier layer; and
forming a capacitor including a bottom electrode, a dielectric layer and a top electrode on the second diffusion barrier layer.