Method and apparatus for registration with integral alignment optics
A method and apparatus for front to back substrate registration is described. Alignment characteristics of features on surfaces of substrates can be used to physically align substrates with a multiplicity of integrated alignment optics. Measurement of offsets of the integral alignment optics are used to compute registration data for use in calibration of the substrate global alignment.
1. An integral alignment optic comprising:
a projection alignment component device on a first planar surface of an in-situ photolithography apparatus, the first surface also including a first set of features, the projection alignment component device comprising a centered axicon that projects a bright dot and a bright ring onto a second planar surface when illuminated by collimated light, wherein the second planar surface is offset in a direction perpendicular or normal to the first planar surface and is rigidly attached to the first planar surface, and the second planar surface not conjugate to the first planar surface with respect to any projection imaging system; and
a target alignment component device attached to the second planar surface, the target alignment device being centered on a single projection alignment component device on the first planar surface, the target alignment component comprising a metal plate with an opening nominally centered on the bright dot and one or more openings centered along the perimeter of the bright ring.
2. The integral alignment optic of claim 1 , wherein the in-situ photolithography apparatus is an in-situ interferometer or an in-situ- source metrology tool.
3. An integral alignment optic as defined in claim 1 , wherein the projection alignment component on the projection component is a fresnel zone plate.
4. An integral alignment optic as defined in claim 1 , wherein the projection component is a silicon wafer.
5. An integral alignment optic as defined in claim 1 , wherein the projection component is a notched wafer.
6. An integral alignment optic as defined in claim 1 , wherein the projection component is a flat panel display.
7. An integral alignment optic as defined in claim 1 , wherein the projection component is a reticle.
8. An integral alignment optic as defined in claim 1 , wherein the projection component is a mask.
9. An integral alignment optic as defined in claim 1 , wherein the projection component is an electronic recording media.
10. An integral alignment optic as defined in claim 1 , wherein the first surface is a reticle.
11. An integral alignment optic as defined in claim 1 , wherein the first surface is a mask.
12. An integral alignment optic as defined in claim 1 , wherein the second surface is a semiconductor.
13. An integral alignment optic as defined in claim 1 , wherein the second surface is a silicon wafer.
14. An integral alignment optic as defined in claim 1 , wherein the second surface is a notched wafer.
15. An integral alignment optic as defined in claim 1 , wherein the second surface is a flat panel display.
16. An integral alignment optic as defined in claim 1 , wherein the second surface is an electronic CCD.
17. An integral alignment optic as defined in claim 1 , wherein the second surface is a diode array.
18. An integral alignment optic as defined in claim 1 , wherein the second surface is a metal plate.
19. An integral alignment optic as defined in claim 1 , wherein the second surface is an electronic recording media.
20. An integral alignment optic as defined in claim 1 , wherein the second surface is an aperture plate.
21. An integral alignment optic as defined in claim 1 , wherein aligning the first and second surface to each other is performed real-time.
22. An integral alignment optic as defined in claim 1 , wherein aligning the first and second surface to each other comprises adjusting a separation between the first and second surface.