IP Library Granted Patent US 7,346,468
Granted Patent B2
US 7,346,468 · App. 11/463,058 · Granted Mar 18, 2008

Method and apparatus for detecting heat sink faults

Assignee: International Business Machines Corporation
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Quick Facts
Patent No.
US 7,346,468
App. No.
11/463,058
Filed
Aug 8, 2006
Granted
Mar 18, 2008
Kind
B2
Examiner
BUI, BRYAN
Art Unit
2863
USPC
702/136
Abstract

Detecting, predicting, and diagnosing faults in a cooling system. According to one embodiment, a heat sink is in thermal contact with a heat-generating electronic component. When a temperature differential between the electronic component and the heat sink exceeds a set point, a fault signal is generated. The set point may be empirically or theoretically determined. The set point may be a static set point, or it may be a dynamic set point determined according to real-time operational parameters of the system. The system may be implemented with predictive failure analysis (PFA) to provide a more reliable, efficient, inexpensive, and robust computer system.

Claims (43)

1. A method comprising:

sensing a source temperature of a heat-generating electronic component in an electronic system;

sensing a sink temperature of a heat sink in thermal communication with the heat-generating electronic component;

determining an actual temperature differential between the source temperature and the sink temperature; and

outputting a fault signal in response to the actual temperature differential exceeding a set point indicative of a heat sink fault.

2. The method of claim 1 , further comprising selecting the set point as a function of real-time values of one or more system parameters.

3. The method of claim 1 , further comprising:

recording the source temperature at a first time;

computing a time interval between the first time and a second time wherein the sink temperature is substantially equal to the source temperature at the first time; and

selecting the set point as a function of the time interval.

4. The method of claim 1 , further comprising:

detecting one or both of an air flow rate and a fan speed; and

selecting the set point as a function of one or both of the air flow rate and the fan speed.

5. The method of claim 1 , further comprising:

detecting an inlet air temperature upstream from the heat sink; and

computing the set point as a function of the inlet air temperature.

6. The method of claim 1 , wherein the heat-generating electronic component comprises a CPU.

7. The method of claim 1 , further comprising calibrating one or more temperature sensors for sensing one or both of the source temperature and the sink temperature prior to powering on the electronic system.

8. A device, comprising:

a source temperature sensor in direct thermal communication with a heat-generating electronic component of the electronic system;

a sink temperature sensor in direct thermal communication with a heat sink of an electronic system, wherein the heat sink is in thermal communication with the heat-generating electronic component;

a processor in electronic communication with the sink temperature sensor and the source temperature sensor, the processor configured for computing a set point indicative of a heat sink fault as a function of one or more operational parameters of the electronic system, computing an actual temperature differential as a function of the sink temperature and the source temperature, and for outputting a fault signal in response to the actual temperature differential exceeding the set point.

9. The device of claim 8 , wherein the computer is configured for recording the source temperature at a first time, computing a time interval between the first time and a second time wherein the sink temperature is substantially equal to the source temperature at the first time, and selecting the set point as a function of at least the time interval.

10. The device of claim 8 , wherein the one or more operational parameters are selected from air flow rate, fan speed, inlet air temperature, and combinations thereof.

11. The device of claim 8 , wherein the heat-generating electronic component comprises a CPU.

12. A machine-accessible medium containing instructions, which when executed by a machine, cause the machine to perform operations, comprising:

instructions for sensing a source temperature of a heat-generating electronic component in an electronic system;

instructions for sensing a sink temperature of a heat sink in thermal communication with the heat-generating electronic component;

instructions for determining an actual temperature differential between the source temperature and the sink temperature; and

instructions for outputting a fault signal in response to the actual temperature differential exceeding a set point indicative of a heat sink fault.

13. The machine-accessible medium of claim 12 , further comprising:

instructions for selecting the set point as a function of real-time values of at least one of the one or more system parameters;

instructions for recording the source temperature at a first time;

instructions for computing a time interval between the first time and a second time wherein the sink temperature is substantially equal to the source temperature at the first time; and

instructions for selecting the set point as a function of the time interval.

14. The machine-accessible medium of claim 12 , wherein the operations further comprise:

instructions for detecting one or both of an air flow rate and a fan speed; and

instructions for selecting the set point as a function of one or both of the air flow rate and the fan speed.

15. The machine-accessible medium of claim 12 , wherein the operations further comprise:

instructions for detecting an inlet air temperature upstream from the heat sink; and

instructions for computing the set point as a function of the inlet air temperature.

16. The machine-accessible medium of claim 12 , wherein the set point is a function of one or more of an air flow rate, a fan speed, and an inlet air temperature.

17. The machine-accessible medium of claim 12 , wherein the heat-generating electronic component comprises a CPU.

Assignments (3)
CHANGE OF NAME Recorded Oct 6, 2017
From: GOOGLE INC.
To: GOOGLE LLC
Reel/Frame 044142/0357 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2011
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GOOGLE INC.
Reel/Frame 026894/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2006
From: BASHOR, PAUL DOUGLAS; MCMILLAN, HENRY GAINES; PURRINGTON, CHALLIS LLEWELLYN; SCOLLARD, MICHAEL LEO; STRANKEVICH, VICTOR A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 018068/0579 →
Continuity (1)
Related Publication 20080040067A1 · Feb 14, 2008