IP Library › Granted Patent US 7,347,901
Granted Patent B2
US 7,347,901 · App. 10/721,500 · Granted Mar 25, 2008

Thermally zoned substrate holder assembly

Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 7,347,901
App. No.
10/721,500
Granted
Mar 25, 2008
Kind
B2
Abstract

A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas-or vacuum-filled chamber).

Claims (11)

1. A thermally zoned substrate holder, comprising:

a base upper portion having top and bottom surfaces, the top surface configured to support a substrate and the bottom surface having a recess formed therein;

a plurality of temperature control elements inside the recess, each element having a top surface seated in the recess and a bottom surface forming a floor of said recess;

at least one thermal insulator having a lower coefficient of thermal conductivity than a material of the base, the at least one insulator being positioned within said recess and disposed between the plurality of temperature control elements and substantially thermally separating the plurality of temperature control elements; and

a base lower portion positioned within said recess and seated to said floor of said recess to substantially fill said recess, wherein the at least one insulator comprises a gas chamber configured to receive a gas at a predetermined pressure via a piping system disposed in the base upper portion which couples the gas chamber to an external gas supply.

2. The apparatus of claim 1 , wherein said chamber has a cross-sectional width of approximately 2 mm.

3. The apparatus of claim 1 , wherein said chamber comprises support material different from said base.

4. A thermally zoned substrate holder, comprising:

a base upper portion having top and bottom surfaces, the top surface configured to support a substrate and the bottom surface having a recess and a piping system formed therein;

a plurality of temperature control elements inside the recess, each element having a top surface seated in the recess and a bottom surface forming a floor of said recess;

at least one thermal insulator having a lower coefficient of thermal conductivity than a material of the base, the at least one insulator being positioned within said recess and disposed between the plurality of temperature control elements and substantially thermally separating the plurality of temperature control elements; and a base lower portion positioned within said recess and seated to said floor of said recess to substantially fill said recess, wherein said at least one insulator extends within approximately 1 mm of said top and bottom surface and said at least one insulator comprises a reflective surface.

Continuity (2)
Provisional Application 6042954000 · Nov 29, 2002
Related Publication 20040115947A1 · Jun 17, 2004