Device for increased thermal conductivity between a printed wiring assembly and a chassis

1. A guide device for providing an additional thermal path from a printed wiring assembly to a chassis, the guide device comprising:

an elongated thermally conductive rod having a plurality of mounting apertures for removably connecting the rod to a chassis mounting surface, the chassis mounting surface having a plurality of connectors in a slot that are configured to mate with the plurality of mounting apertures; and

a wedgelock attached to the rod and comprising a plurality of wedge segments, wherein at least one of the wedge segments is configured to move away from at least one of the other wedge segments to expand the wedgelock;

wherein when the rod is connected to the chassis mounting surface and the wedgelock is torqued to clamp the rod against a portion of the printed wiring assembly in the chassis, an additional thermal path is created from the printed wiring assembly to the chassis through the rod.

2. The guide device of claim 1 , wherein the rod has four elongated surfaces that are a substantially rectangular shape.

3. The guide device of claim 1 , wherein the rod comprises aluminum, an aluminum alloy, copper, a copper alloy, stainless steel, or combinations thereof.

4. The guide device of claim 3 , wherein the rod is plated with copper, gold, or any other soft metal.

5. An electronic assembly, comprising:

a heat sink chassis having at least one slot defined by a sidewall and a mounting surface;

at least one printed wiring assembly comprising:

a printed wiring board including a first side and an opposite second side, the printed wiring board including an end portion disposed in the slot that provides a thermal path to the sidewall of the chassis; and

at least one integrated circuit package electrically attached to the first side of the printed wiring board; and

a guide device disposed in the slot, the guide device comprising an elongated thermally conductive rod and a wedgelock, the guide device having one or more apertures in the rod for connecting the rod to the mounting surface of the slot; wherein the chassis has one or more connectors in the slot that mate with the one or more apertures in the rod; and

wherein the rod of the guide device provides an additional thermal path from the printed wiring board to the chassis.

6. The electronic assembly of claim 5 , further comprising a second integrated circuit package electrically attached to the second side of the printed wiring board.

7. The electronic assembly of claim 6 , further comprising a third integrated circuit package electrically attached to the first side of the printed wiring board.

8. The electronic assembly of claim 7 , further comprising a fourth integrated circuit package electrically attached to the second side of the printed wiring board.

9. The electronic assembly of claim 5 , wherein the guide device is removably connected to the mounting surface of the slot.

10. The electronic assembly of claim 5 , wherein the rod has four elongated surfaces that are a substantially rectangular shape.

11. The electronic assembly of claim 5 , wherein the rod comprises aluminum, an aluminum alloy, copper, a copper alloy, stainless steel, or combinations thereof.

12. The electronic assembly of claim 11 , wherein the rod is plated with copper, gold, or any other soft metal.

13. The electronic assembly of claim 5 , further comprising a thermal bridge cover disposed over the first side and in thermal communication with the integrated circuit package, the thermal bridge cover having an end portion disposed in the slot.

14. An electronic assembly, comprising:

a heat sink chassis having at least one slot defined by a sidewall and a mounting surface;

at least one printed wiring assembly comprising:

a printed wiring board including a first side and an opposite second side, the printed wiring board including an end portion disposed in the slot that provides a thermal path to the sidewall of the chassis;

at least one integrated circuit package electrically attached to the first side of the printed wiring board;

at least one integrated circuit package electrically attached to the second side of the printed wiring board;

a first thermal bridge cover disposed over the first side and in thermal communication with the integrated circuit package attached to the first side of the printed wiring board, the first thermal bridge cover having an end portion disposed in the slot; and

a second thermal bridge cover disposed over the second side and in thermal communication with the integrated circuit package attached to the second side of the printed wiring board, the second thermal bridge cover having an end portion disposed in the slot; and

a guide device disposed in the slot, the guide device comprising an elongated thermally conductive rod and a wedgelock, the guide device having one or more apertures in the rod for connecting the rod to the mounting surface of the slot; wherein the chassis has one or more connectors in the slot that mate with the one or more apertures in the rod; and

wherein the rod of the guide device provides an additional thermal path from the printed wiring board to the chassis.

15. The electronic assembly of claim 14 , wherein the guide device is removably connected to the mounting surface of the slot.

16. The electronic assembly of claim 14 , wherein the thermal bridge covers comprise aluminum, an aluminum alloy, copper, a copper alloy, a carbon composite, stainless steel, or combinations thereof.