Multi-tap microelectromechanical inductor
An apparatus, system, method, and article for a multi-tap microelectromechanical inductor are described. The apparatus may include an inductor formed on a substrate, a switching mechanism contacting the inductor to vary inductance of said inductor; and a disconnect mechanism contacting the inductor to reduce parasitic effects of the inductor upon actuation of said switching mechanism. Other embodiments are described and claimed.
1. An apparatus, comprising:
an inductor formed on a substrate;
a switching mechanism contacting the inductor to vary inductance of said inductor, said switching mechanism comprising one or more microelectromechanical switch armatures; and
a disconnect mechanism contacting the inductor to reduce parasitic effects of the inductor upon actuation of said switching mechanism.
2. The apparatus of claim 1 , wherein said inductor is formed on a single layer of said substrate.
3. The apparatus of claim 1 , wherein said inductor is formed on multiple layers of said substrate.
4. The apparatus of claim 1 , wherein said microelectromechanical switch armatures comprise one or more cantilever-type switches.
5. The apparatus of claim 1 , wherein said disconnect mechanism comprises one or more microelectromechanical switches.
6. The apparatus of claim 1 comprising a first inductor formed on a first layer of said substrate and a second inductor formed on a second layer of said substrate.
7. A system, comprising:
an antenna;
a microelectromechanical node to couple to said antenna, said microelectromechanical node comprising:
an inductor formed on a substrate;
a switching mechanism contacting the inductor to vary inductance of said inductor; and
a disconnect mechanism contacting the inductor to reduce parasitic effects of the inductor upon actuation of said switching mechanism.
8. The system of claim 7 , wherein said inductor is formed on a single layer of said substrate.
9. The system of claim 7 , wherein said inductor is formed on multiple layers of said substrate.
10. The system of claim 7 , wherein said switching mechanism comprises one or more microelectromechanical switch armatures.
11. The system of claim 10 , wherein said microelectromechanical switch armatures comprise one or more cantilever-type switches.
12. The system of claim 7 , wherein said disconnect mechanism comprises one or more microelectromechanical switches.
13. The system of claim 7 comprising a first inductor formed on a first layer of said substrate and a second inductor formed on a second layer of said substrate.
14. The system of claim 7 , wherein said microelectromechanical node forms part of an impedance matching system including.
15. The system of claim 7 , wherein said microelectromechanical node forms part of a radio frequency identification transceiver.