Multilayer electronic component and method for producing the same
A multilayer electronic component including a multilayer ceramic capacitor is disclosed, which includes a laminate of dielectric layers and internal electrodes disposed on the dielectric layers; at least one via-conductor penetrating the dielectric layers and connecting to the internal electrodes; and at least one external terminal formed on an outer surface of the laminate and connecting to an end of the via-conductor, wherein the external terminal includes a lower bump formed on the outer surface of the laminate and an upper bump formed on the lower bump, and a diameter of the upper bump is smaller than that of the lower bump.
1. A multilayer electronic component comprising:
a laminate of dielectric layers and internal electrodes disposed on the dielectric layers;
at least one via-conductor penetrating the dielectric layers and connecting to the internal electrodes; and
at least one external terminal formed on an outer surface of the laminate and connecting to an end of a via-conductor,
wherein the external terminal comprises a lower bump formed on the outer surface of the laminate and an upper bump formed on the lower bump, and a diameter of the upper bump is smaller than that of the lower bump.
2. The multilayer electronic component as claimed in claim 1 ,
wherein a projected area of the upper bump is smaller than that of the lower bump and is larger than that of the via conductor, all as viewed from a direction normal to the outer surface of the laminate.
3. The multilayer electronic component as claimed in claim 1 , wherein the external terminal is made mainly of nickel and is co-fired with the laminate.
4. The multilayer electronic component as claimed in claim 1 , wherein the upper bump has a rounded shape.
5. The multilayer electronic component as claimed in claim 1 , wherein at least the upper bump of the external terminal is plated with nickel and gold.
6. The multilayer electronic component as claimed in claim 1 , wherein the multilayer electronic component is a multilayer ceramic capacitor.
7. The multilayer electronic component as claimed in claim 1 , further comprising an IC chip or an IC chip carrying substrate soldered to one or more upper bumps of the external terminal.