Optical module
An optical module includes a stem; a first lead pin and a second lead pin for receiving differential signals, the first and second lead pins penetrating the stem; a mount block fixed to the stem; a laser diode having a pair of electrodes; a submount mounted on the mount block and having a matching resistance, an interdigital capacitor, and a plurality of electrode patterns on a surface on the submount; and a first wire and a second wire electrically connecting the submount to the first and second lead pins, respectively. The laser diode is mounted on one of the electrode patterns on the submount and connected to another one of the electrode patterns on the submount by a third wire such that the laser diode, together with the matching resistance and the interdigital capacitor, forms an electrical circuit. The value of the matching resistance is smaller than an impedance value of a differential signal source supplying the differential signals minus the resistance of the laser diode.
1. An optical module comprising:
a stem;
a first lead pin and a second lead pin for receiving differential signals, the first and second lead pins penetrating the stem;
a mount block fixed to the stem;
a laser diode having a pair of electrodes, the laser diode having a resistance;
a submount mounted on the mount block and having a matching resistance, an interdigital capacitor, and a plurality of electrode patterns on a surface of the submount; and
a first wire and a second wire electrically connecting the submount to the first and second lead pins, respectively, wherein
the laser diode is mounted on a first of the plurality of electrode patterns on the submount and connected to a second of the plurality of electrode patterns on the submount by a third wire such that the laser diode, together with the matching resistance and the interdigital capacitor, forms an electrical circuit,
the matching resistance has a value smaller than an impedance value obtained by subtracting the resistance of the laser diode from impedance of a differential signal source supplying the differential signals, and
the interdigital capacitor having a capacitance selected to reduce signal reflection at a selected frequency.
2. The optical module according to claim 1 , further comprising:
a first interconnection substrate and a second interconnection substrate located on the mount block, sandwiching the submount, wherein
the first and second interconnection substrates are electrically connected to the first and second lead pins, respectively, and
the submount is connected to the first and second interconnection substrates by the first and second wires, respectively.
3. The optical module according to claim 1 , wherein the submount is directly connected to the first and second lead pins by the first and second wires, respectively.
4. An optical module comprising:
a stem;
a first lead pin and a second lead pin for receiving differential signals, the first and second lead pins penetrating the stem;
a mount block fixed to the stem;
a laser diode having a pair of electrodes, the laser diode having a resistance;
a submount mounted on the mount block and having a matching resistance, an interdigital capacitor, and a plurality of electrode patterns on a surface of the submount; and
a first wire and a second wire electrically connecting the submount to the first and second lead pins, respectively, wherein
the laser diode is mounted on a first of the plurality of electrode patterns on the submount and connected to a second of the plurality of electrode patterns on the submount by a third wire such that the laser diode, together with the matching resistance and the interdigital capacitor, forms an electrical circuit,
the matching resistance has a value smaller than an impedance value obtained by subtracting the resistance of the laser diode from impedance of a differential signal source supplying the differential signals, and
the interdigital capacitor and the matching resistance are mutually integrated on the submount.
5. The optical module according to claim 4 , further comprising:
a first interconnection substrate and a second interconnection substrate located on the mount block, sandwiching the submount, wherein
the first and second interconnection substrates are electrically connected to the first and second lead pins, respectively, and
the submount is connected to the first and second interconnection substrates by the first and second wires, respectively.
6. The optical module according to claim 4 , wherein the submount is directly connected to the first and second lead pins by the first and second wires, respectively.