Surface-mounting type electronic circuit unit without detachment of solder
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of plate-shaped metal material having a solder film on the outer surface thereof. Solder bumps are provided on second lands. Since the pedestal bases used as the mounting reference of the insulating substrate is formed in a plate shape and is placed on the same plane as the first lands and the mother board, the contact state between the first lands a the mother board is effectively stabilized. In addition, since the solderable amount is more than that of a conventional invention, the solder is not detached due to an impact.
1. A surface-mounting type electronic circuit unit comprising:
an insulating substrate of which wiring patterns are provided on a top surface;
an electronic component that is connected to the wiring patterns;
a plurality of first lands that are provided on a bottom surface of the insulating substrate;
a plurality of second lands that are connected to the wiring patterns and are provided on the bottom surface of the insulating substrate;
pedestal bases that are soldered to the first lands;
solder bumps that are provided on the second lands, and
a cover that is made of a metal sheet and covers the electronic component mounted on the top surface of the insulating substrate,
wherein the insulating substrate is provided with a hole that is formed at a position of the first lands so as to vertically pass therethrough,
when protrusions provided on the cover and each having a length shorter than a thickness of the insulating substrate are inserted into the hole, the portion is soldered to the first lands so that the cover is grounded to the first lands,
wherein the pedestal bases are made of plate-shaped metal material having a solder film on the outer surface thereof, and are soldered so that top surfaces of the pedestal bases are positioned on the first lands, and
the pedestal bases are used as a mounting reference of the insulating substrate with respect to a mother board, so that bottom surfaces of the pedestal bases and the solder bumps are soldered to the mother board.
2. The surface-mounting type electronic circuit unit according to claim 1 ,
wherein an area of the first lands is larger than that of the second lands and
the area of the top and bottom surfaces of the pedestal bases is larger than that of the second lands.
3. The surface-mounting type electronic circuit unit according to claim 2 ,
wherein the area of the first lands is several times larger than that of the second lands, and
the area of the top and bottom surfaces of the pedestal bases is several times larger than that of the second lands.
4. The surface-mounting type electronic circuit unit according to claim 1 ,
wherein the pedestal bases are disposed to be positioned at three corners of a triangular shape.
5. The surface-mounting type electronic circuit unit according to claim 1 ,
wherein the pedestal bases are disposed to be positioned at four corners of a quadrilateral shape.
6. The surface-mounting type electronic circuit unit according to claim 1 ,
wherein the pedestal bases are disposed to be positioned at four corners of the quadrilateral insulating substrate.
7. The surface-mounting type electronic circuit unit according to claim 1 ,
wherein an electronic component thinner than the pedestal bases is mounted at the center on the bottom surface of the insulating substrate.
8. The surface-mounting type electronic circuit unit according to claim 2 ,
wherein the pedestal bases are disposed to be positioned at three corners of a triangular shape.
9. The surface-mounting type electronic circuit unit according to claim 2 ,
wherein the pedestal bases are disposed to be positioned at four corners of a quadrilateral shape.
10. The surface-mounting type electronic circuit unit according to claim 2 ,
wherein the pedestal bases are disposed to be positioned at four corners of the quadrilateral insulating substrate.
11. The surface-mounting type electronic circuit unit according to claim 2 ,
wherein an electronic component thinner than the pedestal bases is mounted at the center on the bottom surface of the insulating substrate.
12. The surface-mounting type electronic circuit unit according to claim 3 ,
wherein the pedestal bases are disposed to be positioned at three corners of a triangular shape.
13. The surface-mounting type electronic circuit unit according to claim 3 ,
wherein the pedestal bases are disposed to be positioned at four corners of a quadrilateral shape.
14. The surface-mounting type electronic circuit unit according to claim 3 ,
wherein the pedestal bases are disposed to be positioned at four corners of the quadrilateral insulating substrate.
15. The surface-mounting type electronic circuit unit according to claim 3 ,
wherein an electronic component thinner than the pedestal bases is mounted at the center on the bottom surface of the insulating substrate.
16. A surface-mounting type electronic circuit unit comprising:
an insulating substrate of which wiring patterns are provided on a top surface;
an electronic component that is connected to the wiring patterns;
a plurality of first lands that are provided on a bottom surface of the insulating substrate;
a plurality of second lands that are connected to the wiring patterns and are provided on the bottom surface of the insulating substrate;
pedestal bases that are soldered to the first lands;
solder bumps that are provided on the second lands, and
a cover that is made of a metal sheet and covers the electronic component mounted on the top surface of the insulating substrate,
wherein the insulating substrate is provided with a hole that is formed at a position of the first lands so as to vertically pass therethrough, and a side part that is connected to the first lands is provided at a side surface of the hole,
when protrusions provided on the cover and each having a length shorter than a thickness of the insulating substrate are inserted into the hole, the portion is soldered to the side part and solder is filled within the hole so that the cover is grounded to the first lands,
wherein the pedestal bases are made of plate-shaped metal material having a solder film on the outer surface thereof, and are soldered so that top surfaces of the pedestal bases are positioned on the first lands, and
the pedestal bases are used as a mounting reference of the insulating substrate with respect to a mother board, so that bottom surfaces of the pedestal bases and the solder bumps are soldered to the mother board.