IC card
To provide an IC card, which secures satisfied flatness of the card surface to achieve good printing properties on the card surface. An IC card has a core layer which includes a plurality of sheet materials wherein inner core sheets adjacent to an IC module have through holes formed in a region corresponding to the IC mounted portion, wherein a relationship A=(B 1 +C 1 )±30 μm is satisfied, where A (μm) represents the sum of heights of the through holes, B 1 represents a projection height on an IC mounted surface of the IC module, and C 1 represents a projection height on an IC non-mounted surface. By virtue of having this structure, the IC card can secure card flatness sufficient to obtain satisfied printing properties with respect to the rewrite sheet.
1. An IC card comprising:
an IC module which comprises an IC chip mounted on an insulating substrate having an antenna coil, a sealing material which encapsulates said IC chip, and a chip reinforcing plate provided on at least an IC mounted surface of said insulating substrate and formed on said IC chip through said sealing material; and
a core layer comprising a plurality of sheet materials having said IC module disposed therebetween,
wherein,
in said plurality of sheet materials, at least the sheet materials adjacent to said IC module have a through hole (a) for containing therein said IC chip said sealing material and said chip reinforcing plate, and (b) formed to penetrate the adjacent sheet materials in a region corresponding to an IC mounted portion of said IC module before placing said IC chip therein,
said plurality of sheet materials constituting said core layer comprise at least a pair of inner core sheets adjacent to said IC module,
a relationship (B 1 +C 1 )−20 μm≦A≦(B 1 +C 1 )+10 μm is satisfied, where A (μm) represents the sum of heights of said through holes, B 1 (μm) represents a projection height from an IC mounted surface of said IC module, and C 1 (μm) represents a projection height from an IC non-mounted surface of said IC module,
the relationships B=B 1 ±30 μm, and C=C 1 ±30 μm are satisfied, wherein B (μm) represents a height of said through hole on the side of the IC mounted surface of said IC module, and C (μm) represents a height of said through hole on the side of the IC non-mounted surface of said IC module, and
said through holes are larger than at least one of a length and a width of said sealing material and than at least one of a length and a width of said chip reinforcing plate so as to form at least one empty region in said through holes.
2. The IC card according to claim 1 , wherein said plurality of sheet materials constituting said core layer comprise at least a pair of inner core sheets adjacent to said IC module, and an outer core sheet stacked on at least one of said pair of inner core sheets.
3. The IC card according to claim 1 , wherein said core layer has a rewritable display layer formed on at least one surface of said core layer.
4. The IC card according to claim 1 , wherein, in said sheet materials constituting said core layer, at least a pair of sheet materials having said IC module disposed therebetween includes a material comprising a copolymer of terephthalic acid, cyclohexanedimethanol and ethylene glycol, and polycarbonate.
5. The IC card according to claim 1 , wherein said sheet materials constituting said core layer comprise a no-chlorine-containing material.
6. An IC card comprising:
an IC module which comprises an IC chip mounted on an insulating substrate having an antenna coil, a sealing material which encapsulates said IC chip, and a chip reinforcing plate provided on at least an IC mounted surface of said insulating substrate and formed on said IC chip through said sealing material; and
a core layer comprising a plurality of sheet materials having said IC module disposed therebetween,
wherein,
in said plurality of sheet materials, at least the sheet materials adjacent to said IC module have a through hole (a) for containing therein said IC chip said sealing material and said chip reinforcing plate, and (b) formed to penetrate the adjacent sheet materials in a region corresponding to an IC mounted portion of said IC module before placing said IC chip therein,
a relationship of (B 1 +C 1 )−20 μm≦A≦(B 1 +C 1 )+10 μm is satisfied, wherein A (μm) represents the sum of heights of said through holes, B 1 (μm) represents a projection height on an IC mounted surface of said IC module, and C 1 (μm) represents a projection height on an IC non-mounted surface of said IC module,
the relationships B=B 1 ±30 μm, and C=C 1 ±30 μm are satisfied, wherein B (μm) represents a height of said through hole on the side of the IC mounted surface of said IC module, and C (μm) represents a height of said through hole on the side of the IC non-mounted surface of said IC module, and
said through holes are larger than at least one of a length and a width of said chip reinforcing plate so as to form at least one empty region in said through holes.