Structure for fixing an electronic device to a substrate
A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the substrate and on which said heat-releasing plate of the electronic device is to be soldered, a through-hole formed in and penetrating said substrate and said land portion. The through-hole is adapted to release heat generated in the electronic device. The structure further includes a partitioning portion provided to be positioned between the heat-releasing plate and the land portion. The partitioning portion is adapted for preventing a solder, which should partially run out from a specific edge portion of the heat-releasing plate on soldering the heat-releasing plate to the land portion, from partially flowing into the through-hole.
1. A structure for fixing an electronic device having a heat-releasing plate to a substrate, said structure, comprising:
a substrate;
a land portion which is formed on a front face of the substrate and on which said heat-releasing plate of the electronic device is to be soldered;
a through-hole formed in and penetrating said substrate and said land portion, said through-hole being adapted to release heat generated in said electronic device, and said through-hole being formed in one side area of said land portion, said electronic device being disposed such that a specific edge portion of the heat-releasing plate is positioned in an other side area of the land portion; and
a partitioning portion provided to be positioned only between the one side area and the other side area of the land portion and between the heat-releasing plate and the land portion, said partitioning portion being adapted for preventing a solder, which should partially run out from the specific edge portion of the heat-releasing plate on soldering the heat-releasing plate to the land portion, from partially flowing into the through-hole.
2. The electronic device-fixing structure set forth in claim 1 , wherein said partitioning portion comprises a solder resist for covering an electroconductive portion of said substrate.
3. The electronic device-fixing structure set forth in claim 1 , wherein said land portion comprises an extension portion extending along an inner peripheral face of said through-hole and a back face of the substrate from said front face of the substrate, and a solder is filled in the through-hole.
4. The electronic device-fixing structure set forth in claim 1 , wherein the partitioning portion is formed integrally with the land portion.
5. The electronic device-fixing structure set forth in claim 1 , wherein the partitioning is integrally formed on a lower face of the heat-releasing plate.