Heat dissipation device

1. A heat dissipation device comprising:

a heat sink adapted for thermally contacting with a heat generating component, the heat sink comprising at least a heat pipe having an evaporating portion adapted for absorbing heat from the heat generating component and a condensing portion for dissipating the heat; and

a cooling member having a cold surface attached to one part of the heat sink and the condensing portion of the at least a heat pipe to make the one part of the heat sink and the condensing portion of the at least a heat pipe have a temperature lower than any other part of the heat sink and the evaporating portion, respectively;

wherein the cooling member comprises a thermoelectric cooler attached on the one part of the heat sink and the condensing portion of the at least a heat pipe.

2. The heat dissipation device as claimed in claim 1 , wherein the cooling member further comprises a fin assembly attached on the thermoelectric cooler.

3. The heat dissipation device as claimed in claim 1 , wherein the heat sink comprises a base, a plurality of fins extending from the base and three heat pipes thermally connecting the base and the fins.

4. The heat dissipation device as claimed in claim 3 , wherein the cooling member is arranged on a top of the fins and attached to the condensing portion of each heat pipe.

5. The heat dissipation device as claimed in claim 4 , wherein the evaporating portion of each heat pipe is received in the base and the condensing portion of each heat pipe is received in the top of the fins, the condensing portion being attached with the cold surface of the cooling member.

6. The heat dissipation device as claimed in claim 5 , wherein the thermoelectric cooler defines three grooves in a bottom thereof respectively accommodating the condensing portions of the heat pipes.

7. The heat dissipation device as claimed in claim 6 , wherein a fan is arranged at a lateral side of the heat sink.

8. A heat dissipation device comprising:

a heat sink adapted for contacting with a heat-generating electronic component, the heat sink comprising a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins; and

a thermoelectric cooler having a fin assembly thereon, the thermoelectric cooler comprising a cold surface attached to one side of the fins and the at least one heat pipe to make the one side of the fins having a lower temperature than any other part of the fins.

9. The heat dissipation device as claimed in claim 8 , wherein the at least one heat pipe comprises an evaporating portion received in the base and a condensing portion received in a top of the fins, the thermoelectric cooler being in thermal contact with the top of the fins and the condensing portion.

10. The heat dissipation device as claimed in claim 9 , wherein the thermoelectric cooler defines a slot in a bottom thereof for accommodating the condensing portion of the at least one heat pipe.

11. The heat dissipation device as claimed in claim 10 , wherein the thermoelectric cooler includes a semiconductor having Peltier effect, the top of the fins being in thermal contact with a cool side of the semiconductor.

12. The heat dissipation device as claimed in claim 11 , further comprising a fan arranged on a lateral side of the heat sink.

13. The heat dissipation device as claimed in claim 12 , further comprising an airflow guider arranged on another lateral side of the heat sink and opposite the fan, the air guider being used for guiding an airflow generated by the fan to flow downwardly.

14. A heat dissipation device comprising:

a heat sink having a base adapted for contacting with a heat-generating electronic component;

a heat pipe having an evaporating portion thermally connecting with the base and a condensing portion; and

a thermoelectric cooler being applied with an electrical voltage to have a cold surface and a hot surface, wherein the cold surface is thermally connected with the condensing portion of the heat pipe.

15. The heat dissipation device as claimed in claim 14 further comprising a fin assembly engaging with the hot surface of the thermoelectric cooler.

16. The heat dissipation device as claimed in claim 15 , wherein the condensing portion of the heat pipe is sandwiched between a top of the heat sink and the cold surface of the thermoelectric cooler.

17. The heat dissipation device as claimed in claim 16 further comprising a fan for generating an airflow through the heat sink.

18. The heat dissipation device as claimed in claim 17 further comprising a guider for guiding the airflow to flow downwardly.

19. The heat dissipation device as claimed in claim 16 , wherein the base has a groove in a bottom surface thereof, the evaporating portion of the heat pipe is received in the groove.