3D optoelectronic micro system
View Patent ↗A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by connecting the layers with optical connections. The fabrication process includes a first step of selectively exposing an adhesive bond whose adhesive strength changes by exposure, a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate, and a third step of selectively ring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern.
1. A process of transferring thin-film devices, comprising:
a step of forming an adhesive bond whose adhesive strength changes by light exposure on a supporting substrate;
a step of selectively exposing the adhesive bond to reduce the adhesive strength of part of the adhesive bond;
a step of transferring a thin-film device array onto the selectively-exposed adhesive bond in accordance with an exposure pattern;
a step of exposing an area where the thin-film device array is transferred, wherein the exposing is done through a backside of the supporting substrate; and
a step of contacting a substantial substrate with the thin-film device array formed on the adhesive bond exposed from the backside of the supporting substrate to transfer part or all of thin-film devices in the thin-film device array onto the substantial substrate.
2. A process of transferring thin-film devices, comprising:
a first step of selectively exposing an adhesive bond which is formed on a supporting substrate and whose adhesive strength changes by light exposure;
a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate;
a third step of selectively transferring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern;
a fourth step of exposing the adhesive bond from a backside of the supporting substrate to reduce the adhesive strength of the selectively-exposed adhesive bond; and
a fifth step of contacting a substantial substrate with the thin-film device array formed on the adhesive bond exposed from the backside of the supporting substrate to transfer part or all of the thin-film devices in the thin-film device array onto the substantial substrate.
3. A process of transferring thin-film devices according to claim 2 , comprising, after the fourth step, a step of reexposing the adhesive bond.
4. A process of transferring thin-film devices, comprising:
a first step of selectively exposing an adhesive bond which is formed on a supporting substrate and whose adhesive strength changes by light exposure;
a second step of contacting the selectively-exposed adhesive bond with a first thin-film device array on a first substrate;
a third step of selectively transferring at least a part of thin-film devices in the first thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern;
a fourth step of contacting the selectively-exposed adhesive bond with a second thin-film device array on a second substrate to selectively transfer at least a part of thin-film devices on the second substrate onto the adhesive bond in accordance with the exposure pattern;
a fifth step of exposing the adhesive bond from a backside of the supporting substrate to reduce the adhesive strength of the selectively-exposed adhesive bond; and
a sixth step of transferring the thin-film devices which have been transferred to the supporting substrate onto a substantial substrate.
5. A process of transferring thin-film devices, comprising:
a first step of selectively exposing an adhesive bond whose adhesive strength changes by light exposure;
a second step of contacting the selectively-exposed adhesive bond with a first thin-film device array on a first substrate to selectively transfer part of thin-film devices in the first thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern;
a third step of contacting the selectively-exposed adhesive bond with a second thin-film device array on a second substrate to selectively transfer part of thin-film devices in the second thin-film device array from the second substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern; and
a fourth step of reexposing the adhesive bond from a backside of the supporting substrate and transferring the first and the second thin-film devices to another substrate.
6. A process of transferring micro devices, comprising:
a first step of selectively depositing a thin film on an adhesive bond to create an adhesive pattern having at least a higher adhesive strength area and a lower adhesive strength area;
a second step of contacting the adhesive bond where the thin film is selectively deposited with a micro device array on a first supporting substrate; and
a third step of selectively transferring part of micro devices in the micro device array from the first supporting substrate onto the higher adhesive strength area in accordance with the adhesive pattern.
7. A process of transferring micro devices, comprising:
a first step of selectively creating an irregular surface on an adhesive bond to create an adhesive pattern having at least a higher adhesive strength area and a lower adhesive strength area;
a second step of contacting the adhesive bond where the irregular surface is created with a micro device array on a first supporting substrate; and
a third step of selectively transferring part of micro devices in the micro device array from the first supporting substrate onto the higher adhesive strength area in accordance with the adhesive pattern.