Thin multichip flex-module
View Patent ↗A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.
1. A low insertion force multichip in-line module comprising:
a substantially rigid frame;
a flex circuit having a plurality of integrated circuit chips disposed thereon, said flex circuit having contacts at least partially exposed along one edge of said frame; and,
a compliant layer disposed between said exposed flex circuit and said rigid frame, whereby controlled deformation of said compliant layer enhances electrical continuity between said contacts and corresponding external electrical pins.
2. The module of claim 1 wherein said contacts are arranged along the bottom edge of said module, said external pins are located below said contacts, and said controlled deformation is produced by a downward force applied to said module.
3. The module of claim 1 wherein said contacts are arranged along at least one lateral surface of said module, said external pins are located adjacent to said contacts, and said controlled deformation comprises a lateral deflection produced by a cam disposed within said compliant layer.
4. The module of claim 1 wherein said external pins are part of a socket assembly.
5. The module of claim 1 wherein said external pins comprise electrodes formed on the surface of a circuit board.
6. A low insertion force multichip in-line module comprising:
a substantially rigid frame;
a flex circuit having a plurality of integrated circuit chips disposed thereon, said flex circuit having contacts at least partially exposed along one edge of said frame;
a socket configured to matably engage said module; and,
a compliant layer disposed between said exposed flex circuit and said rigid frame, whereby controlled deformation of said compliant layer enhances electrical continuity between said contacts and corresponding external electrical pins.
7. The module of claim 6 wherein said contacts are arranged along the bottom edge of said module, said external pins are located below said contacts, and said controlled deformation is produced by a downward force applied to said module by a latch mechanism incorporated in said socket.
8. The module of claim 6 wherein said contacts are arranged along at least one lateral surface of said module, said external pins are located within said socket adjacent to said contacts, and said controlled deformation comprises a lateral deflection produced by a cam disposed within said compliant layer.